CAMBRIDGE, UK – Smooth, functional surfaces that provide touch sensing, often with backlighting, are becoming increasingly common. Applications range from vehicle interiors and domestic appliances to medical devices and aircraft seating. Rather than relying on a mechanical or membrane switch, these surfaces utilize capacitive touch sensing - the same principle used in smartphone displays. Capacitive sensing and backlighting of course require electronics behind the decorative exterior surface: in-mold electronics is an emerging manufacturing approach that promises to make functional surfaces cheaper, lighter, and more aesthetically pleasing.

What Is In-Mold Electronics?

As the name suggests, in-mold electronics (IME) is a manufacturing method in which at least some of the electronics are subjected to a molding process. Typically, this starts with screen printing the desired pattern of conductive ink onto a substrate (often polycarbonate) - these conductive patterns enable capacitive touch sensing. Next, a decorative layer is applied to the front, and the conductively patterned substrate is thermoformed to produce the required curvature. A subsequent injection molding step is often applied. This approach of integrating electronics into the molded part contrasts with conventional electronics manufacturing techniques, in which decorative user-facing parts would be molded, and a printed circuit board (PCB) mounted onto the back afterward.

Why risk subjecting the electronics to this molding process when a PCB behind a decorative surface would often suffice? Depending on the approach used, IME enables a weight and material consumption reduction of up to 70% relative to conventional mechanical switches. Furthermore, since fewer individual parts are required, both assembly and associated supply chains can be simpler. Given these advantages, along with growing engagement from both suppliers and integrators, IDTechEx forecast the market for IME parts that incorporates SMD (surface mount device) components to reach around US$2bn by 2033.

What Are the Competing Approaches?

Within the umbrella term of 'in-mold electronics', there are many subtly different manufacturing approaches. Establishing which approach has been used is often tricky since the resulting functional surfaces look extremely similar. Two key variables are whether and at what point SMD components such as LEDs are mounted, and whether injection molding is utilized.

Arguably the most comprehensive approach to IME, developed by Tactotek and termed IMSE (in-mold structural electronics), involves mounting SMD components on a flat substrate prior to thermoforming. This is followed by injection molding, embedding the components and conductive traces in plastic. The process results in a robust part with fully enclosed electronics, potentially including an integrated circuit.

A competing strategy is to mount the SMD components onto an already thermoformed part and neglect the injection molding. This requires a thicker polymeric substrate to provide sufficient rigidity, which generally reduces the degree of distortion and curvature that can be introduced via thermoforming. Furthermore, SMD components can only be mounted via pick and place on regions that remain flat. However, for many applications, only slight curvature around the perimeter or in other specific locations is required, and since mounted components will not be subjected to the heat and pressure associated with molding material specifications and design rules may be more forgiving.

The simplest approach to IME is to omit the SMD components altogether. Decorative surfaces with integrated capacitive touch can be produced relatively straightforwardly by first screen printing conductive ink then thermoforming the substrate. Subsequent injection molding is optional. While these parts would require conventional electronics for backlighting, they represent an intermediate step between purely decorative and fully functional surfaces that can meet the needs of simpler use cases.

What Does the Future Hold?

The wide variety of competing manufacturing approaches to in-mold electronics doesn't imply a Darwinian scenario with only one winner - each approach offers a different balance of cost, form factor complexity, functionality, robustness, and size/weight reduction that can meet a particular need. Overall, IDTechEx envisages a gradual trend towards greater functionality integration since it offers the most scope material and weight reduction but with greater adoption barriers than simpler manufacturing approaches.

How Do I Learn More?

IDTechEx's new report, "In-Mold Electronics 2023-2033", draws on over 20 company profiles, the majority based on interviews, to explore this emerging manufacturing methodology. This comprehensive report evaluates the technical processes, material requirements and applications. It includes 10-year market forecasts by manufacturing methodology and application sector, expressed as both revenue and functional surface area. Furthermore, the report provides a detailed evaluation of competing approaches, such as functional film bonding and the merits of including components such as LEDs within the IME parts.

To find out more, including downloadable sample pages, please visit www.IDTechEx.com/IME 

PENANG, MALAYSIA – We are honored to receive CommScope's satisfaction testimonial who was amazed by the capabilities of the V810i Advanced 3D X-ray Inspection (AXI) Solution and the outstanding support from ViTrox’s Sales Channel Partner (SCP) in Mexico, SMTo Engineering SA de CV.

CommScope is a well-known global provider of communication network infrastructure solutions — providing copper, fiber optic, and wireless network infrastructure components, network management software, network analytics, and consulting services, among other goods and services. CommScope serves a wide spectrum of customers from many industries, assisting them in the design, management, and optimization of their communication networks to meet the dynamic demands of today's digital landscape. After their successful installation of ViTrox’s V810i S2 XLT AXI in 2020, CommScope has experienced and achieved effective and efficient production processes since then.

Jonathan Ramirez, Maintenance Manager at CommScope Tijuana said, “I am pleased to recognize the exceptional work of ViTrox and SMTo Engineering, with which we have built a fruitful client-vendor relationship. We have significantly improved our production processes by installing ViTrox’s V810i S2 XLT X-ray inspection machine in line. The early detection of process problems has allowed us to continuously improve our product quality, all for the benefit of our customers. Thanks to the state-of-the-art technology used by ViTrox, we can provide the best possible products and services for our clients. The V810i S2 XLT solution has proven to be a valuable asset in guaranteeing the quality of our products.” Jonathan added, “SMTo Engineering, representing ViTrox, has always provided excellent support with excellent response times, which has allowed us to avoid any negative impact on our production lines. We appreciate their commitment to ensuring our production runs smoothly. We hope to continue improving our customer-supplier relationship with ViTrox and SMTo Engineering.”

Telecommunication and Network market segments often involve big PCB boards and dense connectors, which require a large X-Ray inspection platform in production. ViTrox V810i S2 XLT is designed for extensive coverage of board sizes as large as 965.2mmx660.4mm (38"x26"), with a top clearance of up to 50mm. V810i S2 XLT allows users to perform programming set-up with ease and it has 7 main algorithms covering 23 preset joint types with all the threshold setting compliance with IPC Class. This AXI solution also has a powerful automated system mechanism, with a motorized Z-height for multiple resolutions of inspections that cater to different component sizes, and a motorized height sensor for extra safety precautions when it comes to component height checking. ViTrox’s AXI also contains 3DCT Technology with Advanced Reconstruction Technology (ART), which offers numerous benefits, ensuring that defects are more visible and easier to detect. ART can also identify BGA balls with HiP defects which are often difficult to detect using traditional inspection methods. Therefore, users can rest assured that they will be using state-of-the-art technology for their PCBA X-Ray inspection.

Additionally, customers can be guaranteed top-notch sales and service support from ViTrox and SMTo. SMTo is a key valued partner of ViTrox in Mexico, best known for its outstanding service support in handling customer inquiries and ensuring customer satisfaction. Besides that, SMTo Engineering has established full sales and service support in Tijuana, Monterrey, Reynosa, and Chihuahua to provide better support to the customer. For more information on SMTo, please contact Juan Carlos Santoyo (juancarlos.santoyo@smto.mx) for further assistance.