PENANG, MALAYSIA – ViTrox, which aims to be the world’s most trusted technology company, is excited to announce our first-ever collaboration with our Sales Channel Partner (SCP), Compmaq. We will be co-exhibiting at the International Fair of the Electrical, Energy and Automation Industry (FIEE), at Booth #F10 in Sao Paulo Expo, São Paulo, Brazil from 18th to 21st July 2023.

As one of the biggest industrial shows in Brazil, FIEE provides the perfect platform for us to unveil our latest inspection solutions, which are the V310i Advanced 3D Solder Paste Inspection (SPI) Solution, V510i Advanced 3D Optical Inspection (AOI) Solution, and of course, our Industry 4.0 Manufacturing Intelligence Solutions - V-ONE.

The V310i 3D SPI is the key to ensuring SMT product quality, providing effortless programming while achieving excellent repeatability and accurate inspection results. Equipped with Ultra Smart Programming, users can instantly start inspection without manual parameter setup, making it user-friendly even for inexperienced operators. Another great piece of news to share with you is that our SPIs have successfully qualified for the IPC-CFX-2591 Qualified Products Listing (QPL). Read more about our V310i 3D SPI Solution.

Next in our line-up will be the V510i 3D AOI solution, which is well-implemented with in-depth Artificial Intelligence (A.I.) Smart Technologies. Thanks to A.I. Smart Programming, our AOI is breaking free from reliance on humans, turbocharging programming speed, and ensuring unparalleled quality, precision, and consistency in inspections. Brace yourself for an astonishing 80% reduction in programming time, translating to soaring yields and lower operating costs. Our V510i 3D AOI has also successfully qualified for the IPC-CFX-2591 Qualified Products Listing (QPL) and has received the mandatory IPC-CFX messages for classification. Read more about our V510i 3D AOI Solution.

Last but not least, the unveiling of our cutting-edge Industry 4.0 Manufacturing Intelligence Solutions - V-ONE, a Smart Manufacturing necessity that ensures connectivity within the production line, accurate visualization of data analytics and adept reactivity in Machine-2- Machine (M2M) production. Designed with customisable, flexible drill-down charts and dashboards that optimize production efficiency with insightful real-time information and A.I. prediction, implementing V-ONE allows stakeholders to optimize production through insightful analytics on a real-time basis exceedingly. With V-ONE, anyone can monitor the production status anytime, anywhere. Read more about the unique features available in our V-ONE: A.I. VVTS, ONE View, and Intelligent Control Tower.

Don't miss out on this amazing opportunity to meet and connect with us at FIEE 2023! Our experts from ViTrox will be there to answer all your questions and ensure you have an incredible experience at our booth. Simply click the registration link to choose your preferred appointment time and meet our field experts in person!

For more information, contact our experts from ViTrox, Mr Jacky Nyia (to- yuam.nyia@vitrox.com) and Mr Guilherme (guilherme.pereira@vitrox.com), or from Compmaq, Mr Tiago (tiago.silva@compmaq.com.br) and Ms Caroline (caroline@compmaq.com.br). We hope to see you soon!

PLYMOUTH, UK – Bentec are pleased to announce that Gareth O’Flattery has joined their team as a Technical Sales Engineer. Gareth is a highly qualified engineer with a range of experience as listed below.

List of experience:

• Designing, manufacturing, testing, and commissioning of a wide range of quality instrumentation (electronic, mechanical, pneumatic products).
• Aiding the supply chain with technical and commercial support.
• Traveling to customer sites as an Application Engineer for production line commissioning.
• Producing detailed specifications for specific customer orders through collaboration with the customer, sales, engineering, and production teams.
• Implementing & control of 'Standard work', generating, maintaining & improving manufacturing documentation (Standard operating procedures, Test Schedules, Bills of materials etc.), ensuring all documentation meets ISO 9001.
• Carrying out the NPI (New Product Introduction) process, working with engineering development teams, influencing the design process to incorporate manufacturing and customer requirements from the initial development stages.
• Providing day-to-day manufacturing engineering support for production cells to enable customer schedule adherence.
• Investigating & implementing ECR’s (Engineering Change Requests) & implementing ECN’s (Engineering Change Notifications).

Gareth will work closely with the very experienced Bentec team, enabling him to advise and support customer requirements.

“We are delighted to welcome Gareth into our Bentec team. He will offer a new perspective to our customers due to his wide experience in comparable production environments,” said David Bennett Managing Director of Bentec.

The Bentec team has decades of experience selling and supporting MIRTEC, the industry’s leading Inspection equipment, as well as many new innovative technologies unique in the SMT sector. They have direct sales as well as a network of representatives who promote the Bentec product offering.

HANAU, GERMANY – Heraeus Electronics is proud to announce its participation in the EU-funded research project "ALL2GaN" (Affordable smart GaN IC solutions for greener applications). This collaborative project, led by Infineon Austria, brings together 45 partners from twelve countries with a total budget of approximately 60 million euros. The aim of ALL2GaN is to harness the energy-saving potential of gallium nitride (GaN) power semiconductors, making them easily integrable into various applications to enhance energy efficiency and reduce emissions.

Energy efficiency plays a vital role in reducing carbon emissions and achieving climate neutrality. Gallium nitride (GaN) chips have emerged as a game-changing technology in this regard. They deliver more power in a compact size, ensuring highly efficient energy conversion and minimizing the carbon footprint of digital devices.

As part of the ALL2GaN project, Heraeus Electronics will focus on developing innovative packaging materials specifically tailored for the new generation of GaN chips. These materials will support the miniaturization and high power density of GaN chips, enabling their seamless integration into a wide range of applications. The project aims to create a modular and easily adaptable GaN power semiconductor toolbox, allowing for swift integration into various applications. This versatility will result in increased energy efficiency and reduced CO2 emissions.

Telecommunications, data centers, server farms, e- mobility, renewable energies and smart grid solutions are among the sectors that will benefit from the highly integrable GaN chip generation "Made in Europe." Projections indicate that this new GaN chip generation can reduce energy losses in applications by an average of 30 percent, saving approximately 218 megatons of CO2 worldwide.

"ALL2GaN is a significant step towards achieving the European Green Deal goals. By developing cost-efficient and easily integrable GaN chips, we are accelerating the transition towards a greener and more sustainable future," said Dr. Michael Jörger, Head of Business Line Power Electronic Materials. "We are excited to collaborate with leading industry partners and contribute to the advancement of energy-saving technologies that will benefit multiple sectors and reduce the carbon footprint."

The ALL2GaN project aligns with the European Union's objectives to drive climate neutrality, promote sustainable growth, and establish a competitive and resilient European industry. It is a key building block in the European Chip Act, fostering the development of a robust European chip ecosystem and contributing to European tech sovereignty. Heraeus Electronics is committed to driving innovation and sustainability in the power electronics industry, and its participation in the ALL2GaN project demonstrates its dedication to shaping a greener and more energy-efficient future.

For more information about the ALL2GaN project, please visit the official project website: https://www.all2gan.eu/home 

For more information about Heraeus Electronics, visit www.heraeus-electronics.com 

CLINTON, NY – As a proud Gold Sponsor of IPC’s Integrated Electronics Manufacturing & Interconnections (IEMI) 2023, advanced materials innovator Indium Corporation is pleased to exhibit innovative materials for e-Mobility and share technical expertise in Pune, India on August 3.

A strong supporter of the Make in India campaign, Indium Corporation’s involvement in IEMI 2023 is further evidence of its commitment to serving India’s growing electronics market now and into the future.

“With our facility in Chennai, Indium Corporation is well positioned to support regional demand for consumer and infrastructure electronics, such as EV manufacturing, mobile, 5G, and semiconductors,” said Senior Country Sales Manager Damian Santhanasamy. “We look forward to serving the Indian electronics market, not only with our innovative materials, but by providing local technical expertise.”Additionally, Associate Director for Global Technical Service & Application Engineering Jonas Sjoberg will participate in an expert panel discussion titled Importance of Electronics in Electric Vehicles. Sjoberg has more than 25 years of technical experience in the electronics industry, including developing and deploying leading-edge designs and processes for packaging and assembly; managing research and development projects and facilities; and serving as technical advisor to internal and external design, development, and manufacturing sites worldwide.

With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature its Rel-ion™ suite of electrical, mechanical, and thermal solutions which are designed to be reliable, scalable, and proven materials to reduce electric vehicle (EV) manufacturers’ time to market. More than three million EVs are currently on the road with Indium Corporation’s Rel-ion products.

Rel-ion material solutions deliver reliability by:

• Eliminating non-wet opens and head-in-pillow defects
• Preventing dendritic growth by meeting stricter surface insulation resistance requirements
• Preventing solder delamination with precise bondline control and increased creep and fatigue resistance
• Reducing hot spots-induced voiding through improved thermal efficiency