Products
MKP1848H series of automotive-grade DC-Link metallized polypropylene film capacitors are optimized for high humidity environments.
WS-829 for printing and pin transfer applications, including LED die-attach, can be used for ball-attach on substrate in a standard BGA process, especially for sphere applications <0.25mm, as well as wafer-/panel-level packaging.
Press Releases
- Mycronic High Flex changes division name to PCB Assembly Solutions; Clemens Jargon Comments
- PRIDE Industries Invests in Kurtz Ersa POWERFLOW Wave Soldering System to Expand High-Reliability Electronics Manufacturing Capabilities
- Federal Electronics Adds AS9100 Certification to Hermosillo, Mexico Facility, Expanding Aerospace & Defense Capabilities
- SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO
POPULAR
- Editorial Contributions
- How Squeegee Blade Profile Helps Improve the Screen-Printing Process
- Verifying PCBA Cleanliness with Ion Chromatography
- Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems
- Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization