Products
EZReball 6,000 ball count BGA preforms consist of 4,000 solder balls on a 0.4mm pitch over a 45mm x 45mm package.
CX90B series top-mount USB 2.0 Type-C connector has 16 contacts. Is reportedly ideal for applications susceptible to high-vibration and drop impacts, including control systems, drones, medical devices, smart meters, point-of-sale equipment, imaging equipment and other small portable devices.
EP21ARLV two-part epoxy may be used as adhesive, sealant, coating or encapsulant. Is capable of withstanding prolonged exposure to 70% sulfuric acid, 10% hydrochloric acid, 10% nitric acid and butyl acetate.
Press Releases
- Mycronic High Flex changes division name to PCB Assembly Solutions; Clemens Jargon Comments
- PRIDE Industries Invests in Kurtz Ersa POWERFLOW Wave Soldering System to Expand High-Reliability Electronics Manufacturing Capabilities
- Federal Electronics Adds AS9100 Certification to Hermosillo, Mexico Facility, Expanding Aerospace & Defense Capabilities
- SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO
POPULAR
- Editorial Contributions
- How Squeegee Blade Profile Helps Improve the Screen-Printing Process
- Verifying PCBA Cleanliness with Ion Chromatography
- Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems
- Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization