Products
PF735-P267J low melting point lead-free solder paste is designed for jetting. Offers excellent workability and solderability for automatic high-speed jetting production.
V9 low-voiding, no-clean solder paste is formulated to reduce voiding to as low as 1% on BGA and <5% on BTC components, while exhibiting stable print performance on fine-feature devices over 12 hr.
Press Releases
- RBB Welcomes Shawn Myers as Engineering Project Manager
- ECIA’s Market Sentiment Index Average Hits Five-Year High in June Industry Pulse Survey
- Incap Slovakia invests in cleanroom capability to support semiconductor manufacturing requirements
- Orbit Technologies accelerates growth and doubles production capacity with Europlacer iineo placement machine