Products
Print-and-Apply Module is a self-contained, fully-automated system designed to streamline and automate label printing and application in bar code, RFID or hybrid ID environments.
Using existing bar code information, it queries a facility's WMS or other control system for the data needed for label printing. The system can take product data from receiving or pick-and-pass operations and print a shipping label that routes the box through a facility to its final destination. Ideal when throughput requirements demand the automation of the print-and-apply function, operates at over 30 cartons/min.
Typically implemented using the BOSS control system, which handles the interaction of machine and transactional data from the PLC level to the WMS level on one PC.
Standard hardware components include the underlying conveyor, a bar code scanner and printer. Options include a weighing scale and verification scanner. An optional divert unit can redirect rejected product for manual handling. A second optional printer can be added for increased throughput and system redundancy. Can top-apply or side-apply labels.
FKI Logistex North America, www.fkilogistex.com
NORTH BILLERICA, MA --BTU International has announced a number of upgrades to its wafer bump reflow production line.
The addition of an integrated three-axes robot from Brooks Automation enhances wafer handling and the system's capability for 24x7 applications, helping to maximize equipment uptime.
A new, simplified control system that uses a single operator interface provides more precise and flexible control throughout the system, including the reflow oven and flux coater. The control system enables the use of 300-mm standards including E40, E84, E87, E90, E94 and standard SECSII/GEM interface.
Designed to be easily scalable for use in future 300-mm fabrication. Can be used as a 200-mm to 300-mm bridge tool with FOUP inserts; features Brooks Automation FixLOAD loadports for use with 300-mm FOUPs.
BTU International, www.btu.com
Carlsbad, CA — Machine Vision Products (MVP) will highlight the Supra M AOI system in booth 8650 at Semicon West this week in San Francisco, CA.
Modeled after the AutoInspector 1820 series, allowing advanced capabilities in a smaller footprint. With full solder joint inspection and measurement capabilities, comes standard with one large-format digital camera and a high-precision linear x/y stage. The one-camera system allows for a configurable field of view depending on the application. Standard pixel resolution is adjustable from 15 to 22 mm/pixel. Has CAD-driven, library-based programming for precise measurement of component placement and solder joint analysis.
In a 960 x 965 mm footprint, provides an acquisition speed of 20 1.4 images/sec. Can achieve up to 45 sq. cm./sec., depending on board layout and density.
Offers an inspection envelope of 16 x 18", a height of 2,083 mm and adjustable conveyor height from 735 to 965 mm. Includes on-the-fly single camera acquisition, improved optics and lighting, 0201 capability and adaptable algorithms with high detectability and low PPM false accept and false reject rates.
Machine Vision Products Inc., sales@machinevisionproducts.com
Press Releases
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- Kitron Secures EUR 37M order for Next-Generation Tactical Communication Equipment