Circuits Assembly Online Magazine - Current Issue

Products

1075-EXR 44 wave solder flux is developed specifically for Pb-free wave soldering of surface-mount, mixed-technology and through-hole electronic assemblies.

Is water-based and non-flammable, eliminating special storage requirements and reducing VOC emissions. Said to provide excellent surface wetting, eliminate cleaning and reduce solder balling. Can also be used for Sn/Pb assemblies.

Indium Corp., www.indium.com

TOKYO -- Tatsuta System Electronics Co. released a new EMI shield film, SF PC-5000, formulated for flex interconnects, COF, hinge applications in cellular phones, digital camera modules and LCD drivers. Total thickness is 22 microns. Well suited for dynamic flex operations, also acts as a covercoat.

Base dielectric is a soft epoxy only 5 microns thick, covered with 0.1 to 0.15 microns of silver and 17 microns of anisotropic conductive Adhesive. Said to exhibit excellent thermal stability during reflow with no blistering or warpage and minimal shrinkage. Comes with a matte black finish, a 50-micron PET transfer film for handling and a 120-micro film for protection.

Further info.and samples available from FRP Services & Co.: (914) 868-4090 Ext. 110; kobayashi@frpusa.com

Promation recently expanded their in-line label placement stations by adding a “Print on Demand” feature prior to the pick-and-place function.

ELC-100 is a standard in-line label pick-and-place station that uses the customer’s pre-printed label rolls. ELC-200 allows customers to print their labels (based upon select criteria) and have them placed on the PCB.

Both stations can accurately place labels, ranging from 7 x 7 mm to 40 x 40 mm, through the use of an x/y gantry and touch panel interface. Clamshell design allows full access to the labeling system.

Available with YL and LLX size internal conveyors.

Promation, pro-mation-inc.com