Circuits Assembly Online Magazine - Current Issue

Products

K2000 motorized circular blade depanelizer is a safe, easy way to separate prescored PCBs without dust or scrap. Now available with xy table for improved board handling.

PCB panels are singulated by passing the scoreline between two circular blades. Front and back blade guards assure operator safety. An adjustable upper front blade guide assures that only the scoreline can be passed to the cutting area.

When using the xy table, the operator places the PCB onto the guide rails of the table and brings the scoreline between the top and bottom blade guards to pass it to the cutting area. The motor driven lower blade will pull the PCB through to separate the panels. Two cutting speeds are available for optimal PCB separation. Panels up to 12.5 in. can be singulated. Blades are made of long lasting tool steel and can be re-sharpened.

The tooling plate for Simm cards allows exact placement of the PCB matrix onto the moveable base. The plate is positioned on the right side for singulating the carrier strip on the left of the panels and then moved to the other side to singulate the remaining carrier strip. Adjustable end stops for the tooling plate allow for exact positioning of the scoreline with the circular blades. Tooling pins and support rails for either side of the panel guarantee safe placement and support of the SIMM cards. The rails can be adjusted to insure that there is no contact with the components on the cards.

FKN Systek, Fknsystek.com

At SEMICON West booth # 9209, Adhesives Research will feature its ARclad custom PSA tape technology for the semiconductor industry, which includes several tape products for chemical mechanical polishing, as well as a heat-releasable wafer dicing tape for high-risk dies.

PSA tape technologies cover three applications within CMP, including the fabrication of stacked CMP pads, bonding CMP pads to polishing machine platens and bonding CMP textiles to stainless steel polishing heads.

ARclad 90450 is a double-faced bonding tape using one permanent adhesive chemistry for bonding to the top pad and another permanent adhesive chemistry specific to bonding to the foam sub pad.

ARclad 8904 and ARclad90334 were designed for bonding stacked pads to the platen.

Both are double-faced tapes with a permanent adhesive for bonding to the sub pad and a removable adhesive for bonding to the platen. Designed for adhesion to low surface-energy polishing tables. Contain a blue polyethylene release liner. Prevents tearing during application and improve die cutting, while promoting an easy, smooth release. 8904 employs a permanent rubber-based pressure-sensitive adhesive for bonding to the sub pad, while 90334 uses an acrylic permanent pressure-sensitive adhesive.

ARclad 90452 is a permanent/removable double-faced tape with the permanent adhesive designed to bond the polishing pad, without a sub pad, directly to the platen. The removable adhesive allows for easy, clean pad removal when polishing is completed.

ARclad 8917,a permanent/removable CMP/carrier bonding tape, provides good solvent resistance, operability in a broad functional pH range, offers a smooth adhesive surface to improve CMP yields, creates a stronger bond to CMP textiles and ensures clean removability from machine surfaces. Comes with two clear polyester liners for visual inspection of the bonding surface prior to application, has good coat weight (9.0 mils) and total thickness variation control.

Heat-releasable, pressure-sensitive adhesive tapes with a stretchable backing film and a polyester film release liner allow needle-less removal of fragile die, while reducing mechanical damage. With the application of heat, the tapes release cleanly, leaving no adhesive residue. The stretchable backing allows for easier mounting, dicing and die-removal, while enhancing visual system capabilities.

Adhesives Research Inc., www.adhesivesresearch.com

AlSiC (Aluminum Silicon Carbide) is a metal matrix composite suited for optoelectronic housings and lids.

Enables a tailored coefficient of thermal expansion, for compatibility with various electronic devices and assemblies. Unlike traditional housing materials, the isotropic CTE value can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. CTE matching capabilities ensure alignment and precision.

Exhibits a high thermal conductivity that results in efficient thermal dissipation and prevents the bowing and flexing of packaging and substrate material that can lead to failure. Traditional housing materials with lower thermal dissipation can cause delamination, leading to air gaps and poor reliability.

Near and net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and rapid prototyping. The un-restricted geometry enables inclusion of design features such as septums, walls and radial features. The casting process enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes for more advanced thermal management solutions.

CPS Corp., www.alsic.com