Circuits Assembly Online Magazine - Current Issue

Products

DEK will show its cost-saving, throughput-enhancing packaging technologies at booth #7111 during Semicon West in San Francisco.

The company will demonstrate its backside wafer coating process, which is said to allow high throughput on a cost-effective mass imaging system and is capable of exceeding the +/- 12.5mm Total Thickness Variation (TTV) required by most wafer processing manufacturers.

Enabled by metal stencil and emulsion screen technologies, materials can be deposited accurately at high speeds, while achieving control over print thickness and ensuring uniformity. This process will be shown on the Micron-class Galaxy printer platform.

Other packaging applications on display will include: Thermal Interface Material (TIM) imaging and wafer bumping solutions enabled by ProFlow DirEKt Imaging technology; encapsulation that only requires one print stroke; singulation technology utilizing Virtual Panel Tooling (VPT); repeatable ball placement technology and high speed substrate bumping.

DEK, dek.com

Samtec has announced the addition of RF cable connectors and cable assemblies to mate with its line of MMCX, MCX and SMA connectors.

SMA subminiature RF cable assemblies are available with straight and right angle terminations and feature high durability, compact semi-precision connectors. They use .085” (2.16 mm) and .141” (3.58 mm) semi-rigid cables and standard flexible cables, including double-shielded RG-316.

Mini connector cable assemblies are available as jacks and plugs and with a choice of straight or right angle terminations. These quick connect/disconnect style connectors are for applications with limited weight and space availability.

Micro-Mini cable plugs are also available with straight and right angle terminations, and feature quick connect/disconnect style snap-on mating. A “Ganged” variation is also offered for terminating two, four, six or eight wires simultaneously.

Samtec Inc. , samtec.com

Router Solutions Inc. (RSI), a supplier of electronic computer ided design (ECAD) data preparation and paperless repair software, announces the latest release of its CAMCAD data preparation solution.

V4.5 includes the following enhancements:

74 customer driven enhancements
Bill of Materials variant support
Multiple machine support
In-Circuit Test (ICT) Fixture reuse analysis
New Electrical Part Library
Various Design For Test (DFT) improvements
Teradyne Spectrum export module
Seica flying probe export module
DigitalTest ICT export module
MVP Paste AOI export module
MVP Component AOI export module

The new variant support provides the ability to incorporate different variations of a single PCB within a single file without having to duplicate the boards. Users can apply the different variants to the board at any time during the data preparation process, reducing management issues of multiple files for each variant.

With support for over 34 PCB-related writers now in CAMCAD, there is also flexibility to store a specific DFT solution with each electrical test writer within CAMCAD using the multiple machine feature.

Reuse analysis module allows existing fixture information to be imported against an updated revision of a PCB and a report will be generated within minutes showing how easy it will be to use the existing fixture on the new board.

Router Solutions Inc., rsi-inc.com