Products
Alpha OM-565 HRL3 high-reliability low-temp. solder paste is formulated for assemblies to mitigate warpage-induced defects in temperature-sensitive chip-scale packages.
EXOS 10/26 convection reflow soldering system has vacuum chamber of 600mm to handle PCBs with max. length of 600mm.
EP35AOLV is a two-part heat-cured epoxy designed for bonding, sealing, coating and potting applications.
Press Releases
- Yamaha Robotics Introduces a New Program to Minimize Onshoring Costs in North Americ
- Scanfil Appointed Anna-Maria Tuominen-Reini as Chief Supply Chain Officer
- BEST Inc. Provides High-Reliability BGA Reballing and Component Rework Services
- ProcureAbility Releases New Benchmarking Report Confirming Widespread AI Development and Adoption in Procurement with Focus on Targeted Enterprise Results