Henkel Berquist Liqui Form TLF 10000 one-part, high thermal conductivity dispensable gel provides heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.
Table Top Digital Fringe Projection 2.0 (TTDFP2) provides fast and accurate surface topography for discontinuous surfaces at room temp.
DA158N die attach thermal conductive and electrical insulating adhesives can be fast cured at low temp.