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Henkel Berquist Liqui Form TLF 10000 one-part, high thermal conductivity dispensable gel provides heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.

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Table Top Digital Fringe Projection 2.0 (TTDFP2) provides fast and accurate surface topography for discontinuous surfaces at room temp.

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DA158N die attach thermal conductive and electrical insulating adhesives can be fast cured at low temp.

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