Products
AMS 2.0 Advanced Manufacturing Suite recognizes that fast, error-free NPI, minimization of changeovers and labor costs, and logistical efficiency demand that the component placement function is integrated into the overall production environment. Focuses on maximizing the performance of Assembléon machines and providing connectivity to other machines and software in the factory.
Moves many production preparation functions off-line, assures error-free set-ups and eliminates bottlenecks and component starvation.
Rapid NPI is achieved by decoupling preparation tasks from board production through off-line implementation of operations such as creation of vision files and data preparation, electrical verification of R, C and L values, and checking of the barcodes on reels. Provides a central database for programs and vision files.
Has production scheduling and line optimization functionality. Generates placement programs and feeder set-ups for every machine in the production line. A feeder viewer enables analysis and allows dynamic re-assignment of feeders.
Has off-line and on-line verification of set-ups, with an optional CLi interface using RFID technology for automatic set-up verification. Provides line control and data transfer with all machines in the line, with functionality including production line start/stop, upload/download of programs and component database information to the line, MIS data download and line warm-up. Can enable remote line monitoring and operation.
Data from set-up verification supports logistics by monitoring component usage and tracking inventory, issuing an alert on potential shortages to avert component starvation. Timely information to the operator indicates how many boards can still be produced or how many production hours remain with the available on-machine component inventory. The component tracking software also forms the foundation for the lot traceability system, which tracks complete production details on a real-time basis for possible future product recalls.
User interface matches the Assembléon machine user interface.
Assembléon, assembleon.com
Moves many production preparation functions off-line, assures error-free set-ups and eliminates bottlenecks and component starvation.
Rapid NPI is achieved by decoupling preparation tasks from board production through off-line implementation of operations such as creation of vision files and data preparation, electrical verification of R, C and L values, and checking of the barcodes on reels. Provides a central database for programs and vision files.
Has production scheduling and line optimization functionality. Generates placement programs and feeder set-ups for every machine in the production line. A feeder viewer enables analysis and allows dynamic re-assignment of feeders.
Has off-line and on-line verification of set-ups, with an optional CLi interface using RFID technology for automatic set-up verification. Provides line control and data transfer with all machines in the line, with functionality including production line start/stop, upload/download of programs and component database information to the line, MIS data download and line warm-up. Can enable remote line monitoring and operation.
Data from set-up verification supports logistics by monitoring component usage and tracking inventory, issuing an alert on potential shortages to avert component starvation. Timely information to the operator indicates how many boards can still be produced or how many production hours remain with the available on-machine component inventory. The component tracking software also forms the foundation for the lot traceability system, which tracks complete production details on a real-time basis for possible future product recalls.
User interface matches the Assembléon machine user interface.
Assembléon, assembleon.com
Threaded PEM ReelFast SMT spacers/nuts are available in more thread sizes to satisfy a range of application requirements. The fasteners are suited to space or stack PCBs or (as nuts) to mount boards or attach components. They install on PC boards in the same manner and at the same time as other surface-mount components prior to the automated reflow solder process.
Said to reduce the risk of damage to boards (and resulting scrap) that may occur when improperly installing fasteners with off-line equipment; reduce handling of loose parts; and speed assembly by eliminating secondary operations.
Threaded types are offered in sizes #2-56 through #8-32 and M2 through M4; thru-hole (non-threaded) types are available in sizes .116”, .143”, 3.6 mm and 4.2 mm. Lengths range from .065 to .375” and 2 to 10 mm. All types can be installed in boards as thin as .060” and all are RoHS compliant.
Tape-and-reel packaging for their automated installation conforms with industry standards and preferences for other surface-mount components. Each reel carries up to 1,500 parts, depending on fastener size. Fasteners are supplied with Kapton patch for vacuum pickup.
PennEngineering, pemnet.com
Said to reduce the risk of damage to boards (and resulting scrap) that may occur when improperly installing fasteners with off-line equipment; reduce handling of loose parts; and speed assembly by eliminating secondary operations.
Threaded types are offered in sizes #2-56 through #8-32 and M2 through M4; thru-hole (non-threaded) types are available in sizes .116”, .143”, 3.6 mm and 4.2 mm. Lengths range from .065 to .375” and 2 to 10 mm. All types can be installed in boards as thin as .060” and all are RoHS compliant.
Tape-and-reel packaging for their automated installation conforms with industry standards and preferences for other surface-mount components. Each reel carries up to 1,500 parts, depending on fastener size. Fasteners are supplied with Kapton patch for vacuum pickup.
PennEngineering, pemnet.com
Feinfocus and Xradia announce a new 3-D x-ray inspection technology for the semiconductor packaging and medical device industries.
The microXCT defect detection system uses non-destructive 3-D tomography to view the complete structure of advanced packages. Unlike conventional x-ray imaging systems that lose resolution during tomography, this system scans packages in 3-D at full resolution. Multiple resolution modes allow users to switch from navigation at 30µm to high-resolution defect localization and characterization at 1 µm. Automated 3-D tomography features virtual cross-section capability, eliminating the need for sample preparation. Can image and construct a high-resolution 3-D Volumetric dataset with up to 1000 cross-sectional slices in 15min. Has a compact design.
FEINFOCUS, .ch
Press Releases
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”
- Surface-Mount Innovations Delivering More for Less
- Freemelt to Outsource Production to Scanfil
- TAGARNO and Comtree to Host Live Webinar on Digital Microscopes in Canadian Electronics Manufacturing; Jake Kurth Comments