Products
AirMax VS high-speed connector system includes mezzanine, co-planar, high-power, I/O and backplane header versions. Said to offer scalability, flexibility, high density and performance headroom through its use of air as the dielectric and its Insert Molded Leadframe Assembly (IMLA).
Uses edge-coupling technology and an air dielectric between adjacent conductors, delivering high signal density with low insertion loss and low crosstalk, without metal shields.
Dual-beam receptacle contact provides two points of contact, one on each side of the header blade. Vertical header features a robust housing providing generous “lead in.” Comes with protective cover that also serves as press-in block during connector installation.
Comprised of a full set of building blocks for backplane, co-planar, mezzanine and cable-to-board applications. Are scaleable to the number of columns; available with housings in various IMLA counts.
Allow for custom pin assignments (differential or single-ended signals as well as power), so system data rates can grow from 2.5 Gb/s to over 12 Gb/s without re-design of the basic platform.
FCI, fciconnect.com/airmax
FCI, fciconnect.com/airmax
Owens Design partnered with Questar Products International to develop a line of automatic wire bonders built on Kulicke and Soffa’s former Hybrid bonder platforms. Capabilities include fine pitch, large table travel and ball bumping, with user friendly, customizable software. The Questar Q2100 series bonders are designed for a range of complex devices.
John Apgar, president of Owens Design, said, “Our customer challenged us to come up with a cost effective design, replacing and upgrading older technology components, solving difficult electronics layout challenges, while packaging the system and all electronics in a very small footprint, and conforming to all SEMI and CE standards.”
Questar Products International, questarinc.com
Owens Design, owensdesign.com
John Apgar, president of Owens Design, said, “Our customer challenged us to come up with a cost effective design, replacing and upgrading older technology components, solving difficult electronics layout challenges, while packaging the system and all electronics in a very small footprint, and conforming to all SEMI and CE standards.”
Questar Products International, questarinc.com
Owens Design, owensdesign.com
Speedline Technologies will unveil several new options for its MPM Accela printer as well as an upgrade of its MPM UltraPrint 2000 printer at Apex 2006.
Speedline will also showcase its MPM printing, Camalot dispensing and Electrovert soldering and cleaning solutions in booth #1207.
For its parallel processing MPM Accela system – designed high-volume throughput with high yield – the company will introduce:
· A High Speed Inspection option capable of full 2-D inspection of the substrate and/or the stencil at line speed. Built off the patented texture based algorithms and conventional 2-D methods, the option will quantify the inspection results and report them to SPC for process control and decision making.
· An option for process setup verification and traceability using bar code reading capability and enhancements in the machine software. Provides data management down to the board (within the panel) level in the printer.
· An option for closed loop control of the printer using external inspection information.
Speedline Technologies, speedlinetech.com
Speedline will also showcase its MPM printing, Camalot dispensing and Electrovert soldering and cleaning solutions in booth #1207.
For its parallel processing MPM Accela system – designed high-volume throughput with high yield – the company will introduce:
· A High Speed Inspection option capable of full 2-D inspection of the substrate and/or the stencil at line speed. Built off the patented texture based algorithms and conventional 2-D methods, the option will quantify the inspection results and report them to SPC for process control and decision making.
· An option for process setup verification and traceability using bar code reading capability and enhancements in the machine software. Provides data management down to the board (within the panel) level in the printer.
· An option for closed loop control of the printer using external inspection information.
Speedline Technologies, speedlinetech.com
Apex booth 1207
Press Releases
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”
- Surface-Mount Innovations Delivering More for Less
- Freemelt to Outsource Production to Scanfil
- TAGARNO and Comtree to Host Live Webinar on Digital Microscopes in Canadian Electronics Manufacturing; Jake Kurth Comments