Products
Auto-Focus software automatically selects the best reflow oven recipe for new products without running a profile by evaluating a database of previously setup products and extrapolating a new oven recipe based on product and oven characteristics. Instead of relying on a technician’s guess, the user enters the product’s length, width and weight. After a dozen products that cover the required range have been set up properly, the accuracy and quality of the oven recipes developed is so high that most users may no longer find it necessary to run a verification profile.
Valuable to high-mix facilities, high-value assemblers and facilities that want to minimize setup times. Reduces downtime for oven setup.
KIC, kicthermal.com
Booth 363
Valuable to high-mix facilities, high-value assemblers and facilities that want to minimize setup times. Reduces downtime for oven setup.
KIC, kicthermal.com
Booth 363
The manual version of Fineplacer Lambda is used for sophisticated die-attach tasks, such as bonding of flip chips, MEMS, MOEMS and sensors on substrate sizes up to 180 x 136 mm. Placement accuracy is ± 0.5 µm for the A6 and A6V models, or better than ± 0.5 µm for the A7V l. Can be equipped with different viewing equipment including a LEICA microscope or a camera-monitor magnification system.
Features an FA7 heating plate with a 50 x 50 mm heating area; “high ramp rate,” programmable up to 20°C per sec.; thermal conductivity; low thermal expansion; and optional heated inert gas integration.
The automated configuration is equipped with the automatic module package, consisting of the Automatic Bonding Force Module, Motorized Microscope Movement, and PC Control and Bonding WIN Flip Chip Software. Provides auto-touchdown and die placement as well as controlled bonding operation after manual alignment of die and substrate.
Advantages of the automated configuration include hands-off die placement; improved process repeatability ¾ pilot production worthy; places die with dimensions that exceed the optical field of view; provides up to 10 programmable microscope positions; upgradeable with integrated microscope; and features a measurement function as well as a placement mask generator.
Finetech Inc., finetechusa.com
Booth 1481
Features an FA7 heating plate with a 50 x 50 mm heating area; “high ramp rate,” programmable up to 20°C per sec.; thermal conductivity; low thermal expansion; and optional heated inert gas integration.
The automated configuration is equipped with the automatic module package, consisting of the Automatic Bonding Force Module, Motorized Microscope Movement, and PC Control and Bonding WIN Flip Chip Software. Provides auto-touchdown and die placement as well as controlled bonding operation after manual alignment of die and substrate.
Advantages of the automated configuration include hands-off die placement; improved process repeatability ¾ pilot production worthy; places die with dimensions that exceed the optical field of view; provides up to 10 programmable microscope positions; upgradeable with integrated microscope; and features a measurement function as well as a placement mask generator.
Finetech Inc., finetechusa.com
Booth 1481
CX-1 is capable of placing advanced packages such as SiP, MCM and other mixed-technology applications. Features high-accuracy applications as well as standard SMT. Is built on the base of a standard SMT machine, but with highly accurate glass linear encoders. Special software periodically checks and calibrates to ensure accuracy.
With traditional lines, four machines are necessary; however, here only three systems accomplish the same production levels. Addresses the industry challenge of increasing use of bare die and flip chips mixed with standard SMT (such as cell phones, PDAs, etc.).
Compatible with existing feeders and line control software (HLC). Features HMS II to measure board surface height and flatness and placement flatness and the placement force control.
Comes standard with four placement heads capable of laser/vision centering, with independent x and theta motors, that can handle boards up to 330 x 250 mm and feature a standard 27 mm FOV high-resolution camera.
The system offers two modes -- high accuracy and standard accuracy. High-accuracy features speeds of 1,300 (vision) and 1,600 (laser), and an accuracy of ±20 mm. Standard mode features a speed of
11,000 cph and an accuracy of ±40 mm.
Juki Automation Systems, jas-smt.com
Booth 1069
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