Circuits Assembly Online Magazine - Current Issue

Products

The VPD-5 depaneler is said to permit stress-free board separation with components (inlcuding ceramic capacitors) as close as 0.5 mm from the score line. Reportedly handles boards as thin as 0.32", and can separate boards with tall components near the score line (up to 0.800" from the top of the PCB). Panel insertions limited to the score line, preventing operator errors. In two models; for boards up to 10" and 13", respectively.

Fancort Industries, fancourt.com

Hysol QMI536NB non-conductive PTFE-filled paste is for stacked die applications that require extremely low stress and robust mechanical properties. Can be used on all levels of a stacked die, enabling the qualification of a single material. Is said to eliminate provide very low resin bleed and very fast cure. Can be used on solder resist, bare silicon and multiple die passivations. Is lead-free compatible, showing no reliability issues or material deterioration even when processed in higher temperature environments. shows high resistance to delamination and popcorning after multiple exposures to 260°C reflow temperatures.

Henkel, www.electronics.henkel.com

PRO 2 Tdp is a tabletop assembly cell that may be used for low- to mid-volume manufacturing operations that require an LED component be picked, placed and soldered onto a PCB or substrate. The onboard dispensing head also can place a dot of thermal paste or silicon adhesive between the PCB and LED prior to attach. The robot selectively solders with twin irons attaching each side of the LED simultaneously. Dual automatic solder feeders, pre-heat plate and thermal loop feedback are standard.

Promation, Pro-mation-Inc.com