The integrated intelligence concept is based on intelligent feeder and intelligent machine. The feeder records component identity, inventory count and pickup correction so the machine can confirm that it picks the correct component reliably. The machine must be able to enable high throughput when feeders are not in optimized positions. The turret head and machine architecture are reportedly critical to enabling this potential. Said to cope with feeders in any position with limited reduction in placement rate. Every feeder is said to be fully programmable with component and inventory data. Once the feeders are loaded, the machine automatically recognizes the information.
Vigon RC 101 is an MPC technology-based cleaning agent for removing baked-on flux residues from reflow ovens and in wave solder processes. Does not have a flash point. Removes lead-free and eutectic flux residues. Said to reduce solder flakes from fingers. Reportedly reduces consumption losses up to 20x. Meets RoHS and WEEE guidelines.
Dyne-A-Mite IT CO2 Plasma is said to provide superior surface treatment to improve adhesion on a wide variety of materials. The use of gas or liquid-phase CO2 with atmospheric plasma discharge surface pretreatment technology can remove micron and submicron particulates and hydrocarbon-based contaminations on plastics and metals. Increases surface tension of base substrates. Bonding strength is said to be improved. Is suitable for either initial or final cleaning, and for cleaning applications.