Hysol FP4581 and FP4583 are liquid epoxy encapsulants for use as underfills for flip-chip devices. FP4581 is formulated high-lead, bumped large die flip-chip packages. Is said to have low coefficient of thermal expansion properties and improved toughness over previous materials; forms a rigid, low-stress seal on solder joints. Is said to be ideal for flip-chip devices that require improved crack and fracture resistance. Is compatible with most no-clean flux systems. FP4583 is for applications requiring a fine filler. Contains fillers less than or equal to 2 µm in diameter; is formulated for overmolded components.
The YTV B3 benchtop AOI now comes standard with Fusion Lighting. Said to offer up to 3x improvement in inspection speed and advanced image processing. Consists of more than 600 colored LED lights that project to the PCB surface from different angles (high, medium and low). Enhanced contrast in the image is said to allow inspection algorithms to identify features in component body or solder joints that would have been previously difficult to see. Is available with two top-down viewing thin cameras for inspection of components down to 01005s. Cameras reportedly permit small component inspection without a significant increase in cycle times.
Pyramax 100 reflow oven comes in 8-zone air or nitrogen models, and recaches 350ºC maximum temperature. Is Pb-free capable, reportedly has low nitrogen and power consumption, and uses closed loop convection control. Delivers features like side-to-side recirculation, and convection efficiency that reportedly reduces zone temperature set points. Features Windows-based Wincon oven control software and smart-tracking SMEMA conveyors.