Products
The KY-8030 inline solder paste inspection system is for high-mix/low-volume applications. Incorporates optical and image processing technology and feedback tools. Uses full parametric inspection algorithms. Is said to deliver results based on 100% inspection of every paste deposit. Reportedly programs in fewer than 15 min.
Koh Young Technology/Christopher Associates, www.christopherweb.com
Koh Young Technology/Christopher Associates, www.christopherweb.com
XF3 Pb-free solder paste reportedly accommodates extended reflow profiles without use of nitrogen. Is based on patented SN100C alloy, which reportedly has demonstrated long-term fatigue strength over silver-containing SAC-alloys. Is said to remedy copper migration into tin regions of the solder joint. Wetting on all common metal surfaces is said to be excellent. Prints at 150-200-mm per sec.
Cobar Europe, www.cobar.com
System Caston boundary scan software is said to enhance integration with flying probe testers. Enables interaction between flying probe and boundary scan access for board level test applications, embracing IEEE1149.1 applications. Includes management of boundary scan and non-boundary scan components and automatic test program generation, using automatic pin fault diagnostic, graphical fault localization, and debugging. Has new control algorithm. Detected faults are diagnosed after test execution by means of intelligent pin fault diagnostic processors. Includes ScanAssist multi-mode debugger.
Goepel electronic GmbH, www.goepel.com
Goepel electronic GmbH, www.goepel.com
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