Products
SN100C(510) Pb-free flux cored solder wire is said to generate little spatter, even with the high solder tip temperatures required to burn off polyurethane insulating enamel. Reduces risk of copper erosion during soldering and slow growth of the interfacial intermetallic layer in service. Other features include minimal cracking of flux residue, low fuming and odor, and high-temperature soldering. Can be used with soldering tip temperature up to 480°C.
Nihon Superior, www.nihonsuperior.co.jp
Nihon Superior, www.nihonsuperior.co.jp
SP50 for 3-D solder paste inspection features full
volume, height, area and registration measurements. Speeds reportedly up to
38.7cm2/sec. Handles boards up to 19.5 x 19.5”. Features Agilent
head swap technology, which permits alternating equipment from an SP50 to an
SJ50. Has optical encoders and linear motors. speeds may vary depending upon
application. Has scalable 6 μm per pixel resolution and 4 μm height resolution.
Agilent Technologies, www.agilent.com
Agilent Technologies, www.agilent.com
The 781RC MicroMark Recirculating Spray System is said to reduce maintenance and downtime associated with conventional marking systems. Uses a recirculating pump to keep pigments in suspension and a short burst of air after each cycle to clear the nozzle of any residue. Applications include components to printed circuit boards.
EFD Inc., www.efd-inc.com
EFD Inc., www.efd-inc.com
