Products
MT-815 low modulus, high thermal conductivity adhesive can be used for large die, in die attach applications, or as a solder replacement. Has a modulus of <1 GPa; is reportedly less likely to crack or delaminate under the stresses of temperature cycles. Formulated to achieve thermal conductivity of >10 W/m-K.
Lord Corp., www.lord.com
Lord Corp., www.lord.com
Custom SMT pick-and-place nozzles for Cree LED components offer special handling operations to prevent damage to the optical lens. Reportedly avoid mechanical stress on the LED lens by not touching the optical surface during component picking or placement processes. Permit better placements with odd-form components. Can be applied to any style of pick-and-place nozzle for any OEM or machine type.
Count On Tools Inc., www.cotinc.com
Updated IR preheaters are for manual soldering and desoldering of SMT, through-hole and other thermal applications. Occupy minimal space and are ready for use. Total heated area is segmented into four selectable zones. For manual or selective soldering. Complement underpowered rework systems lacking effective bottom heating. Feature flexible board fixtures that are easy to adjust. Spring-loaded board clips permit thermal expansion without bending boards. PCB tooling options are available, including four-sided board support, bottom board support, and extended reach board clips.
VJ Technologies, www.vjt.com
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