Circuits Assembly Online Magazine - Current Issue

Products

Stand-up tip caps seal syringe barrel tips during storage and shipment. Have large, flat bottom surfaces that enable syringe barrel to stand upright. Existing entrapped air migrates to piston, to ease removal. Are molded from polypropylene resin; compatible with a range of dispensing fluids. Feature large knurled gripping surfaces for simple installation and removal. Come in packs of 50 and bulk packages of 1000.

Techcon Systems, www.techconsystems.com

ME-555 underfill encapsulant was developed for semiconductor packaging and assembly. Is comparable with underfills such as Henkel 4256; offers excellent flow characteristics, thermal cycling reliability and low coefficient of thermal expansion. Is a high purity, semiconductor-grade epoxy underfill material for the encapsulation of flip chip devices. Reduces warpage; handles over-molding processes. Can be used under CSP/BGAs and small dies with standoff heights as small as 25µm. Provides good adhesion to laminate, ceramic, solder mask and metal surfaces, as well as high Tg and high fracture toughness.

Lord Corp., www.lord.com

SI-F1000 series micro-head spectral-interference laser displacement sensor is designed to provide high-precision performance in a 2mm diameter sensor head. Is a low power optical system using fiber-optic detecting; measurements can be taken without electromagnetic effects or additional head to measurement system. External signal processing is eliminated. Controller models include built-in digital and analog data outputs. Includes onboard data storage and calculation functions. Applications include wafer thickness and warpage mapping; media thickness and surface characterization, and inline thickness measurement of transparent webs and coatings.

Keyence, www.keyence.com/PRSI