Halogen-free NC-560-HF Pb-free, no-clean solder paste reportedly increases process yields with ENIG, OSP, HASL and immersion silver boards. Delivers lot-to-lot stencil printing consistency, along with good print performance characteristics, including full pad and component wetting and good surface tension, eliminating aperture clogging for up to 20 prints; minimal residue that is non-conductive and non-corrosive; thermal stability at temperatures up to 300°C; viscosity of 650-850 Kcps +10%; low beading and anti-tombstoning; wide process windows with long stencil life, and initial tack value of 33g force. Complies with RoHS; meets highest IPC-7095 voiding performance classification. Is compatible with ICT and AOI.

Amtech, www.amtechsolder.com