Products
Sarcon 30QR is a low hardness thermal interface material that exhibits a thermal conductivity of 1.10 W/m°K and a thermal resistance of .57 °Cin2/W. Is available in roll or sheet form and can be die-cut, molded or extruded. Use for conductive insulator for semiconductors, compression joining material for thermistors and temperature sensors, as well as gap filler material for all types of heaters. This V-0 flame-retardant thin film is recommended for applications with operational temperatures that range from -60°C to +180°C.
Fujipoly America Corp., www.fujipoly.com
PrintoCent Pilot Factory now performs roll-to-roll assembly in addition to roll-to-roll printing. Combines functionalities created through printing technology with silicon-based and other electronic components into a functional end-product. Is automated, and handles entire rolls or any substrate in sheet form, and can be used to assemble a great variety of components, from semiconductor chips size of 100µm to flexible solar panels and batteries.
VTT Technical Research Centre of Finland, www.vtt.fi
PCB West: The Silicon Valley's leading printed circuit design and manufacturing conference: Sept. 25-27, 2012 www.pcbwest.com
VTOS Builder user-configurable verification and test OS provides a test platform for quick verification of new design and debug problems in embedded hardware. Tests for design correctness and production readiness in less than one week. Is reportedly easily configurable for new prototype hardware. Can be used across multiple embedded design projects. Loads and runs on custom hardware in 30 minutes. Uses a device tree without compilation. No OS porting required. New components can easily be added and device parameters configured by editing the device tree.
Kozio, www.kozio.com
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment