Products
Shenmao's SMBF-08 Visible No-Clean BGA Flux is designed to meet the demands of SMT assembly and BGA ball mount processes.
Henkel's Bergquist Hi Flow THF 5000UT phase change film TIM allows for low mechanical pressure to achieve thorough wet out and an ultra-thin bond line at the interface.
Ersa's i-CON Mark 2 soldering station series features soldering tip technology known from the IoT soldering station i-CON TRACE with extremely fast heat-up and reheat characteristics and a precise temperature control of +/- 2°C.
Press Releases
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”
- Surface-Mount Innovations Delivering More for Less
- Freemelt to Outsource Production to Scanfil
- TAGARNO and Comtree to Host Live Webinar on Digital Microscopes in Canadian Electronics Manufacturing; Jake Kurth Comments