Products
Shenzhen Deepmaterial Technologies' latest range of advanced adhesive solutions includes its One Part Epoxy Adhesive, Two Part Epoxy Adhesive, and Magnet Bonding Adhesive.
Hirose's BM56 Series multi-RF board-to-board connector provides a size reduction of up to 71% compared to conventional designs.
Yincae's UF 120HA material is designed to provide a fast flow, lower-temperature cure for high-throughput application.
Press Releases
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”
- Surface-Mount Innovations Delivering More for Less
- Freemelt to Outsource Production to Scanfil
- TAGARNO and Comtree to Host Live Webinar on Digital Microscopes in Canadian Electronics Manufacturing; Jake Kurth Comments