Products
Alconano nano-silver paste makes it possible to join most metals, as well as Si and SiC, at low sintering temperatures, if necessary in nitrogen, without nitrous or sulphurous residues. Achieves strong bonds with high electrical and thermal conductivity at low temperature without external pressure.
Nihon Superior, www.nihonsuperior.co.jp/english
SN100C P506 D4 is a Pb-free, no-clean solder paste. Reportedly can be stored at room temperature for more than 60 days without deterioration. Has excellent consecutive printability.
Nihon Superior, www.nihonsuperior.co.jp/english
ECM CA-175 snap cure conductive adhesive is designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics or camera modules. Has a moderate glass transition temperature and modulus. Has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement; is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces. Reportedly fully cures in 8 sec. at 200°C.
Engineered Materials Systems, www.emsadhesives.com
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