CN-1735 underfill is designed to enhance thermal cycle performance of IC packages with pitches as fine as 0.3mm. Reportedly enhances ruggedness for drop and bend test performance. Has a CTE of 40 ppm/°C. Reportedly can be reworked using elevated temperature (170°C to 180°C) to remove underfill fillet.
Zymet, www.zymet.com
Quantum Q-6800 dispensing system for SMT, PCB packaging, and microelectronics assembly has a dispense area of 423 x 458mm. Novel software is said to optimize dispense-head motion to save time and increase units per hour (UPH) for jetted line applications. Optional dual-action or dual-simultaneous valve configurations maximize high-throughput applications and can reduce dispensing time by up to 50%. Dispenses fluid in dots, lines and patterns. Laser height sensor offers real-time, fast, noncontact dispense height measurement. Vision system incorporates high-brightness, three-color RGB LEDs for image contrast and detection. Automatically compensates for changes in fluid viscosity, ensuring volumetric repeatability and optimized line speed for closed-loop fluid dispensing reliability. Flow calibration feature uses weight-controlled dispensing and automatic calibration to continuously deliver consistent fluid amounts, especially for valve and pump dispensing. Supports most Nordson Asymtek jets, pumps and valves.
Nordson Asymtek, www.NordsonAsymtek.com
StatRez static control floors protect areas requiring static dissipative or conductive flooring. Prevent electrostatic damage to products and equipment, limit the ability of personnel to build up a charge and quickly remove a charge from a person or equipment. Said to be more durable than ESD tile and not dependent on relative humidity. Available flooring includes StatRez PC 350/350C two-coat 100% solids epoxy system, StatRez PC 225/225C three-coat, UV-stable polyurethane system, and StatRez PC 925/925C two-coat epoxy novaloc system designed for extreme chemical resistance or complete protection from acids.
Arizona Polymer Flooring, www.apfepoxy.com