Products
MicroLine 2000 SI laser depaneling system is for rigid and flexible printed circuit boards. Reportedly benefits from a low-stress UV laser beam. Is for removing bare or populated circuits from panels. Reportedly can process any board material, from FR4 to fired ceramics to flexible and rigid-flex substrates.
LPKF, www.lpkfusa.com
Leica DCM8 combined confocal and interferometric optical profiler is for nondestructive 3D surface profiling. Provides high-def confocal microscopy for high lateral resolution and interferometry to reach sub-nm vertical resolution. Provides lateral resolution up to 140nm and vertical resolution of up to 0.1nm. Employs confocal scanning technology without moving parts in the sensor head. Includes four LED light sources: blue (460nm), green (530nm), red (630nm), and white (centered 550nm); has an integrated CCD camera with XY topography-stitching mode.
Leica Microsystems, www.leica-microsystems.com/dcm8
BOMcheck conflict minerals web database provides an integrated tool for uploading EICC GeSI Conflict Minerals Reporting Templates with materials declarations for RoHS, REACH and other regulated substances. Validates data in EICC GeSI Conflict Minerals Reporting Template and provides immediate detailed feedback to correct data validation errors. Can be used to validate compliant smelters.
Environ, www.environcorp.com
