Products
MV-9 SIP is configured with Omni-Vision 2D/3D technology for semiconductor inspection. Combines 25Mp CoaXPress 2D ISIS vision system with digital multi-frequency quad Moiré 3D system for inspection of semiconductor assemblies. Features four 10Mp side-view cameras and 25Mp top-down camera. MP-7 Micro is designed for BGA ball inspection. Is configured with 15Mp ISIS vision system, a 6µm telecentric compound lens and color strobe LED lighting.
Mirtec, www.mirtec.com
Sigma G5JS single-beam mounter implements overdrive technology for utilization of front and rear resources via a single placement head. Head can be high-speed (up to 44mm square single shot recognition) or multifunction. Head is rated at 37,500 cph; multi-function head is rated at 7,000 to 9,000 cph for chip components, excluding transition time of approx. two sec. Can choose from three different tray feeders.
Hitachi High Tech Instruments, http://www.hitachi-hta.com
Press Releases
- Altus Group Invests in Major Headquarters Expansion to Showcase Complete Turnkey Manufacturing Capability
- ViTrox Americas Welcomes Eric Cruz as Technical Support Engineer
- ECD Strengthens Engineering Team with New Software Development Hire
- ViTrox Americas Welcomes Doug Ennis as Senior Field Applications & Service Engineer