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Products

Automated Flash Program Generator (AFPG) supports all in-system programming options. Is a tool for automatic generation of scripts for universal in-system programming of non-volatile memory such as flash devices, and also microcontrollers with integrated flash and via boundary scan. ISP programs mounted devices directly in native environment. Supports universal in-system programming of NAND flash devices, phase change memories, OneNAND components, FPGA embedded instruments, connected processors and via boundary scan. Provides a graphical definition of the command sequence, various possibilities for bad block handling, multi-site support and a block library.

Goepel electronic, www.goepel.com

SMT 88 series underfills enable a faster cure while at room temperature. Are adhesives that reportedly combine advantages of fast cure in UV adhesives and reliability of capillary underfill. Can be underfilled at room temperature without preheating a substrate. Advantages include void-free underfill, easy rework, easy dispensing, outstanding reliability, and excellent mechanical resistance. Can be used for chip scale packaging, ball grid array devices, package-on-package, land grid array, and flip chip applications. Suitable for bare chip protection in packages such as memory cards, chip carriers, hybrid circuits and multichip modules.

Yincae Advanced Materials, www.yincae.com

MDP-300 combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint. Includes synchronous head motion that enables bond head and dispenser to work in parallel. Is said to increase bond quality and enhance overall throughput. Supports up to 300mm (12”) wafer substrates. Connects to SMT machines.

Panasonic Factory Solutions Co. of America, www.panasonicfa.com