FlexTRAK-S plasma system has large capacity plasma chamber for semiconductor and electronics packaging. Integrates with a variety of process equipment.  Has 5.5l plasma chamber and high-power RF generator. Is configurable and has high-throughput. Universal architecture remains the same if elongated. Accommodates substrates and material handling configurations to support a variable-size form factors, including boats, carriers, Jedec/Auer boats, strips, and laminates. Can be configured for magazine-to-magazine processing of single and multiple strips or lead frames, reel-to-reel, and as a standalone for island-based production environments. Width is 382mm. Service components are accessed from the front. Can be configured to apply three different modes of plasma treatment: direct, downstream, and ion-free. Smart Tune management system provides closed-loop plasma control; optimizes RF system and minimizes tuning time. Automatically recycles to a plasma-ready state.

Nordson March,  www.nordsonmarch.com