caLogo

Products

Siplace BulkFeeder X eliminates component reels. Permits tapeless supply of components in sizes 0402, 0201 and 01005 for high-speed applications. Sets up like any classic feeder on changeover table, but holds up to 1.5 million components at a time. Coordinates interplay of shutter and vibration mechanisms, vision system, and placement heads. Eliminates splicing. Uses a vibrating mechanism to pour loose components from a container onto a pickup plate made of glass. Built-in camera takes a picture of the components from underneath the glass plate. The placement machine analyzes the image and determines which components are located on the plate in a position that is suitable for pickup and which are not, for example because they are upside down or too close to each other.

ASM Assembly Systems, www.siplace.com ASM BulkFeederX

Mycronic 4.0 automated, intelligent factory software for just-in-time production enables visibility planning, material tracking, efficient changeovers, automated replenishment and intelligent storage solutions.

Mycronic, www.mycronic.com

DEK Nano Ultra Stencil  is said to improve solder paste transfer by up to 40% in fine-pitch applications with area ratios of less than 0.6. Benefits include volume stability; clean edges for improved print quality; higher process stability; lower underscreen cleaning frequency (reduced underscreen cleaning fabric and cleaning solvent consumption). Coating thickness of 2 to 4µm.

ASM Assembly Systems/DEK, www.dek.com

Page 743 of 2096

Don't have an account yet? Register Now!

Sign in to your account