Products
Supreme 11HTLP two-part epoxy has a bond strength of over 3,200 psi and 20 pli, respectively, in shear and peel mode. Bonds well to a variety of substrates, including metals, glass, ceramics, composites, rubbers and plastics. Withstands thermal cycling as well as impact and shock. Serviceable over a temperature range of -100° to +400°F. Has a 1:1 mix ratio by weight or volume along with a working life of 90-120 min. for a 100g batch. High viscosity. Cures at room temperature or more rapidly at elevated temperatures. Volume resistivity exceeds 1013 ohm-cm, Supreme 11HTLP delivers reliable electrical insulation values. Resists water, oil and fuels. 100% reactive. Comes in 0.5 pint, pint, quart, gallon and 5 gal. container kits.
Master Bond. http://www.masterbond.com/tds/supreme-11htlp
Gap filler 1400SL thermal interface material is a two-part, silicone-based, liquid material with low viscosity for flowing in and around tight, uniquely shaped structures to fill small voids and provide thermal transfer. Thermal conductivity is 1.4W/m-K. Is soft when cured, permitting absorption of coefficient of thermal expansion (CTE) stresses and providing mechanical shock dampening. For applications such as high-power components such as FETs, industrial controllers with transient loads and automotive electronics like DC-DC converters for hybrid vehicles. Low VOC formulation. Cures at room temperature with no byproducts.
Henkel Adhesive Technologies, www.bergquistcompany.com
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