Products
Siplace E series placement machine features a long-board option, new feeder modules, and an improved user interface for faster programming. Comes in two configurations: Flex and Speed. Both are equipped with high-precision linear drives, high-end vision systems and placement force sensors. JTF tray feeder and stick feeder now accommodates Jedec tray feeders and bar magazines. Long-board option handles PCBs up to 1200mm long and 4.5mm high, for LED applications and industrial products. New S-Programming software interface for creating component descriptions and placement programs.
ASM Assembly Systems, siplace.com/
SB6NX58-M500SI solder paste is designed for high-stress environments such as automotive. Contains 6% indium to balance and optimize thermal stress and deformation characteristics. Is said to offer improved solder joint strength over SnAgBiIn paste, especially with AuNi plated components. Anti-shock resistance is five times greater than SB6N, at 150C x 500 hr. aging. Shear strength after T/C at -40/+125C equals that of OSP substrates.
Koki Co., www.ko-ki.co.jp
RoboPlace is deployed in front of selective or wave soldering systems, and does not require any safety guards.
Press Releases
- Javad EMS Upgrades Through-Hole Soldering Capacity with New SEHO PowerWave System
- Sharpen Your Selective Soldering Skills with Kurtz Ersa's July VERSAFLOW 4/55 Training
- Omron Advances Inspection Technology with NVIDIA Omniverse and Metropolis
- Seika Machinery’s SMI 2026 Webinar Series Continues with Focus on PCB Cleaning Before Solder Paste Printing