Products
GPC-R-114 nonflammable, solvent-based cleaning liquid is for manual cleaning applications such as PBA and maintenance cleaning. Dissolves post-soldering flux residues and evaporates quickly without leaving visible residues on substrates. Is compatible will most materials used in electronics assembly and cleaning processes. Noncorrosive. Easy-to-use spray gun applicator.
Balver Zinn Group, balverzinn.com
Gap Pad HC 5.0 thermal interface material is designed to manage heat generated by reduced form factor, high-power density components. Is a soft, compliant gap filling material; has a thermal conductivity of 5.0W/m-K and delivers outstanding thermal performance with low compression stress. Is reportedly ideal for applications that require minimal component or board stress during assembly, yet demand high heat transfer across the interface with very low thermal resistance.
Henkel Adhesive Technologies, www.henkel.com/brands-and-businesses/adhesive-technologies
XF-603 flame-retardant material is for automotive under-the-hood and interior labeling applications. Is UL94 VTM-0 rated and third-party tested to FMVSS 302 automotive burn standard. Thermal transfer and flexographic ink-printable. XF-603 is a high-temperature polyimide rated to the UL94 V0 standard, with low smoke and toxicity and an operational temperature of 260°C. Also comes in a low-cost polyester (PET) (XF-611) that operates at 150°C.
Polyonics, www.polyonics.com
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