Products
535-11M-12 UV cured epoxy has been designed to pass rigorous reliability requirements. Eliminates warpage in electronic assemblies and can be used in other bonding applications in fiber optics and camera modules. Can be used for lens bonding, chip encapsulation in smart cards and general bonding applications in photonics assembly. Cures rapidly when exposed to high-intensity UV light. Is a low outgassing, flexible, high-strength epoxy adhesive that does not contain antimony. Is a screen printable version of 535-11M-7 UV cure adhesive.
Engineered Material Systems, www.emsadhesives.com
Multitouch N9041B UXA Signal Analyzer makes continuous sweeps up to 110GHz. Displayed average noise level as low as -150dBm/Hz (>50GHz). Now delivers wider, deeper views of millimeter-wave signals. Characterizes millimeter-wave signals such as 5G, 802.11, satellite, and radar. Max. analysis bandwidth of 5GHz. Provides two input connectors. Dedicated 1.0mm input connector is machined to exact tolerances. A 2.4mm input connector covers measurements up to 50GHz.
Keysight Technologies, www.keysight.com
AXP 2.0 shadow moiré system provides warpage metrology with lateral/top-bottom temperature uniformity. Has optional modules for DIC strain/CTE measurements and DFP for discontinuous surfaces. Uses top and bottom heaters with shadow moiré.
Akrometrix, www.akrometrix.com
