Products
ISO-Spector S2 5D SPI features patented third-generation sensor technology said to enable unique, simultaneous 2D and 3D inspection.
BH (3.96mm pitch) and BK (5.08mm pitch) series high current board-to-board connectors are available in SMT configuration.
Master Bond EP17HTDA-1 one-component die-attach epoxy can also be used for bonding and sealing.
Press Releases
- Clemsa Achieves up to 75% Faster Changeovers and Higher Quality with Europlacer SMT placement line
- Nordson Test & Inspection to Unveil Next-Generation Inspection and Metrology Technology at SEMICON Taiwan
- AIM Solder Announces New Distribution Partnership with Covermat Co., Ltd. in Thailand
- Automated Production Equipment and Manncorp Announce Strategic Partnership to Expand SMT Solutions for U.S. Electronics Manufacturers