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Home
2019 Magazine Archives
April 2019 issue
2019 Magazine Archives
April 2019 issue
Published: 21 April 2019
by Mike Buetow
View the Digital Edition
Metric 0201 assembly
Warped boards
Head-in-pillow/Head-on-pillow
Misplaced chips
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Federal Electronics Adds AS9100 Certification to Hermosillo, Mexico Facility, Expanding Aerospace & Defense Capabilities
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TTCI Expands Southeastern U.S. Presence Through Partnership with Microwave Component Sources; Bert Horner and Ryan Peavey Comment
Essemtec Expands US Presence with New, Larger Demo Lab in Burlington, MA; Don Jeka Comments
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