November 2012 cover



Advanced Packages
Stepping Out With 0.4mm Pitch BGA/PoPs
OEMs are finding the move from 0.5mm pitch BGA PoP to the next generation, 0.4mm ultra-fine pitch BGA PoP tough, indeed. These rules-of-thumb will help make the jump.
by Syed W. Ali

The Mitchell Plan
IPC's new president is wasting no time remaking the trade group in his own (attentive) image.
by Mike Buetow

ESD Basics
You're Grounded!
Setting up an ESD workstation or area to reduce the risk of electrostatic discharge in the workplace.
by The ESD Association

Electronics Failure Analysis for Pb- and Pb-Free Solder Joints
Why the Weibull distribution is probably the most important distribution for solder material failure analysis.
by Dr. Ron Lasky

Tech Tips
Manufacturing Cost Reduction through Automation
A step-by-step process to cut costs for a high-rel RF tuner.
by ACI Technologies



  • Caveat Lector
    Brokering a new model.
    Mike Buetow

  • Talking Heads
    BBG's Greg Papandrew.
    Mike Buetow



    • ROI
      Restating value.
      Peter Bigelow



  • Process Doctor
    Residues' slow burn.
    Michael McCutchen

  • Defects Database
    Skipping around.
    Dr. Chris Hunt

  • Getting Lean
    Continuous improvement plans.
    Carlos Rodriguez

  • Technical Abstracts
    In Case You Missed It.

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