Stepping Out With 0.4mm Pitch BGA/PoPs
OEMs are finding the move from 0.5mm pitch BGA PoP to the next generation, 0.4mm ultra-fine pitch BGA PoP tough, indeed. These rules-of-thumb will help make the jump.
by Syed W. Ali
The Mitchell Plan
IPC's new president is wasting no time remaking the trade group in his own (attentive) image.
by Mike Buetow
Electronics Failure Analysis for Pb- and Pb-Free Solder Joints
Why the Weibull distribution is probably the most important distribution for solder material failure analysis.
by Dr. Ron Lasky
Brokering a new model.
BBG's Greg Papandrew.
Continuous improvement plans.
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