Cover Story
Could Printed Electronics Replace Traditional Electronics?
Over the next 10 years, printed electronics will make gains in RFID, displays, packaging, ICs, and alternative energy. But a glorious future isn't set in stone.
by Randall Sherman

CIRCUITS ASSEMBLY Top 50
The Trials of 2009
When it comes time to write the story of the EMS industry in 2009, foremost will be the effects of the recession. The subtext, however, will be the dramatic fall of Elcoteq, whose final chapter is still being written. Plus: The 50 largest EMS companies.
by Mike Buetow

Supply Chain Management
Ensuring Component Integrity from an EMS Perspective
Short consumer product lifecycles, the electronics industry’s conversion to lead-free components, and general weakness in the global market have increased the speed at which components are becoming obsolete. And legacy products are prone to fake parts.
by Dennis Gradler

3-D AOI
Improving Solder Paste Printing through Phase Shift Interferometry
New measurement technology enables high degrees of verification and confidence.
by Chrys Shea

Talking Heads
Orpro Vision is looking good.
Mike Buetow

Global Sourcing
Getting vertical.
Rex Green

ROI
Merger mania strikes again.
Peter Bigelow

On the Forefront
Can Japan stay committed to R&D?
E. Jan Vardaman

Screen Printing
Registration using closed-loop control.
Dr. Rita Mohanty

Selective Soldering
The yes/no decision on nitrogen.
Al Cable

Wave Soldering Troubleshooting
Mitigating grainy or dull solder.
Paul Lotosky

The Defects Database
Paste stuck in stencil apertures.
Dr. Davide Di Maio, Ph.D.

Process Doctor
Our standard plea.
Dr. Harald Wack

Materials World
How "free" is halogen-free solder?
Jie Bai

Tech Tips
Component reliability for RF applications.
ACI Technologies Inc.

Solar Technologies
Frontside silver conductor line efficiency.
Tom Falcon

Technical Abstracts
In case you missed it.

DfA
Component Layout in Placement Processes
Effective, accurate component placement takes into account the best practices of design and assembly, both of them inextricably intertwined. Positioning CSPs and noise-sensitive devices are two of a host of considerations.
by Zulki Khan

Component Lead Prep
A Novel Process for Automated Lead Tinning
Tin whisker formation associated with Sn99 finishes and other assembly solder defects are being seen by many companies due to the faster oxidation rates of Sn99 component finishes. Such parts can now be rapidly de-taped, tinned, cleaned and re-taped via new equipment and processes.
by Richard Stadem and Cornel Cristea

Zestron Corp.
Closing the Cleaning Gap
The switch to Pb-free solders and more densely packed boards that effectively turn even trace residues from aesthetic nuisances into potential hazards has brought about a renaissance for cleaning advocates. A trip through Zestron’s tech center outside Munich reveals a company dedicated to fixing these process problems.
by Mike Buetow

Soldering Optimization
Wave Solder Thermal Profiling
Knowing how to set the temperatures in soldering can ease the occurrence of board failures.
by Francisco Anaya

Sherman's Market
Riding the EMS rollercoaster.
Randall Sherman

Talking Heads
Assembléon CEO André Papoular: still up for the challenge.
Mike Buetow

Global Sourcing
When offshoring works best.
Rob Duvall

ROI
Back to basics.
Peter Bigelow

EMC for the Real World
Grover on inductance.
Dr. Eric Bogatin

Screen Printing
Registration using closed-loop control.
Dr. Rita Mohanty

Wave Soldering
Applying gauge R&R for soldering optimization.
Dr. Ursula Marquez de Tino

Wave Soldering Troubleshooting
Rough or disturbed solder.
Paul Lotosky

The Defects Database
Rethinking black pad.
Dr. Davide Di Maio, Ph.D.

Test and Inspection
IEEE test standards 'speed' toward resolution.
Jun Balangue

Tech Tips
Halide fluxes' corrosive effects.
ACI Technologies Inc.

Getting Lean
Sequentially implementing Lean and Lean Sigma.
Carlos Rodriguez

Technical Abstracts
In case you missed it.

Productronica Recap
Trading Up
For the first time in 10 years, we saw the sun in Munich. Is it a sign of a new dawn for the industry? OK, no, but amid tepid expectations, Productronica turned out stronger than expected, again defying gravity and the pundits to remain the mother of all trade shows.
by Mike Buetow

CAM
Improving Fabrication Yields
A large portion of manufacturing yield is tied up in the CAM process, and these "fabrication planners" can make the difference between profits and losses. Plus: The designer's role.
by Zulki Khan

X-Ray Inspection
X-Ray Imaging of Pb-Free Solder Joints
Inspecting Pb-free solder joints requires consideration be given to the implications of the material differences exhibited by the elements present to ensure that optimal image quality is maintained. When optimizing the tube, the actual adjustments are highly dependent on the thickness and mass of the solder joint for various components.
by Dr. Evstatin Krastev

Talking Heads
CyberOptics' Kitty Iverson.
Mike Buetow

Focus on Business
Hiring's golden age.
Susan Mucha

On the Forefront
Potential derailments.
E. Jan Vardaman

Better Manufacturing
Improving test coverage by design.
Andrew Murrietta

Screen Printing
Embedded passives: nothing but a win.
Clive Ashmore

Selective Soldering
Defect-free selective soldering.
Ursula Marquez de Tino, Ph.D.

Wave Soldering Troubleshooting
Solder on the mask.
Paul Lotosky

The Defects Database
Plating-related opens.
Dr. Davide Di Maio, Ph.D.

Process Doctor
Debunking subjective cleanliness assessments.
Harald Wack, Ph.D.

Materials World
Type 4 solder standards.
Jie Bai

Solar Technologies
Solar Power International was a return to the past.
Chrys Shea

Tech Tips
Boundary scan extends its use.
ACI Technologies Inc.

Technical Abstracts
In case you missed it.