Component Layout in Placement Processes
Effective, accurate component placement takes into account the best practices of design and assembly, both of them inextricably intertwined. Positioning CSPs and noise-sensitive devices are two of a host of considerations.
by Zulki Khan
Component Lead Prep
A Novel Process for Automated Lead Tinning
Tin whisker formation associated with Sn99 finishes and other assembly solder defects are being seen by many companies due to the faster oxidation rates of Sn99 component finishes. Such parts can now be rapidly de-taped, tinned, cleaned and re-taped via new equipment and processes.
by Richard Stadem and Cornel Cristea
Closing the Cleaning Gap
The switch to Pb-free solders and more densely packed boards that effectively turn even trace residues from aesthetic nuisances into potential hazards has brought about a renaissance for cleaning advocates. A trip through Zestron’s tech center outside Munich reveals a company dedicated to fixing these process problems.
by Mike Buetow
Wave Solder Thermal Profiling
Knowing how to set the temperatures in soldering can ease the occurrence of board failures.
by Francisco Anaya
Riding the EMS rollercoaster.
Assembléon CEO André Papoular: still up for the challenge.
When offshoring works best.
Back to basics.
EMC for the Real World
Grover on inductance.
Dr. Eric Bogatin
Registration using closed-loop control.
Dr. Rita Mohanty
Applying gauge R&R for soldering optimization.
Dr. Ursula Marquez de Tino
Wave Soldering Troubleshooting
Rough or disturbed solder.
The Defects Database
Rethinking black pad.
Dr. Davide Di Maio, Ph.D.
Test and Inspection
IEEE test standards 'speed' toward resolution.
Halide fluxes' corrosive effects.
ACI Technologies Inc.
Sequentially implementing Lean and Lean Sigma.
In case you missed it.
Off the Shelf