While customers want flexibility and long-term paths to cost reduction that Lean supports, they aren’t always agreeable to the necessary internal changes. But the smaller the effort, the smaller the result.
By Todd Baggett
Copper as a Viable Solution for IC Packaging
As gold prices spike, some are turning to copper in ball-bonding processes for its conductivity and lower cost.
By Sheila Rima C. Magno, Jean Ramos, Eduardo Pecolera and Chris Stai
Embedded Active Components for High-Rel Products
Inside the missile, a heavy module on the board surface was breaking loose and failing. The answer: A solderless, wire-bonded chip-to-board solution covered with copper "lids" to quell vibration.
By Jim D. Raby
XRF Equipment as a RoHS Screening Tool
A jointly funded industry/DTI collaborative project, led by the National Physical Laboratory, investigated the suitability of XRF techniques for determining the presence and levels of RoHS-restricted substances in typical electronics components. The 15-system study found most – but not all – are viable.
By Martin Wickham and Dr. Christopher Hunt
Rabid for Raby.
Bad parts, like colds, come from anywhere, and no one is immune. A new database might help.
Keep an eye on vision.
Large BGA attachment profiling.
American Competitiveness Institute
Wave or selective for high-rel products?
Ursula Marquez de Tino
Test and Inspection
The fixture is in.
Stacy Kalisz Johnson
Localized extraction clearly shows residue volumes at isolated spots.
Pb-Free Lessons Learned
Wake up to the value of boards.
On the cover: An NPL study finds XRF systems beat chemical analysis for unit and operational costs, and time to results. (Photo courtesy RMD Instruments)