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FEATURES

  • Program Management
    Maximizing Lean
    While customers want flexibility and long-term paths to cost reduction that Lean supports, they aren’t always agreeable to the necessary internal changes. But the smaller the effort, the smaller the result.
    By Todd Baggett

  • Component Packaging
    Copper as a Viable Solution for IC Packaging
    As gold prices spike, some are turning to copper in ball-bonding processes for its conductivity and lower cost.
    By Sheila Rima C. Magno, Jean Ramos, Eduardo Pecolera and Chris Stai

  • Recent Patents
    Embedded Active Components for High-Rel Products
    Inside the missile, a heavy module on the board surface was breaking loose and failing. The answer: A solderless, wire-bonded chip-to-board solution covered with copper "lids" to quell vibration.
    By Jim D. Raby

  • COVER STORY
    XRF Equipment as a RoHS Screening Tool
    A jointly funded industry/DTI collaborative project, led by the National Physical Laboratory, investigated the suitability of XRF techniques for determining the presence and levels of RoHS-restricted substances in typical electronics components. The 15-system study found most – but not all – are viable.
    By Martin Wickham and Dr. Christopher Hunt

FIRST PERSON

  • Caveat Lector
    Rabid for Raby.
    Mike Buetow

  • Letters

MONEY MATTERS

  • Global Sourcing
    Bad parts, like colds, come from anywhere, and no one is immune. A new database might help.
    Mike Buetow

TECH TALK

  • Better Manufacturing
    Keep an eye on vision.
    Phil Zarrow

  • Tech Tips
    Large BGA attachment profiling.
    American Competitiveness Institute

  • Selective Soldering
    Wave or selective for high-rel products?
    Ursula Marquez de Tino

  • Test and Inspection
    The fixture is in.
    Stacy Kalisz Johnson

  • Process Doctor
    Localized extraction clearly shows residue volumes at isolated spots.
    Terry Munson

  • Pb-Free Lessons Learned
    Wake up to the value of boards.
    Chrys Shea

  • Technical Abstracts

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Ad Index
Assembly Insider

On the cover: An NPL study finds XRF systems beat chemical analysis for unit and operational costs, and time to results. (Photo courtesy RMD Instruments)

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