October 2007 cover


  • Packaging Roadmap
    R&D Needs for Packaging
    Two areas of research that have evolved quickly during the last two years are SiP and 3-D packaging. The iNEMI Roadmap highlights the approaches and clarifies industry needs.
    Joe Adam

  • SEAs 2007
    The Learning Organization
    Key Electronics’ never-ending pursuit of improvements has boosted it to consecutive Service Excellence Awards.
    Chelsey Drysdale

  • Cover Story
    A Study of 0201s and Tombstoning in Pb-Free Systems
    Tombstoning is reported to occur more frequently in Pb-free systems, and smaller components are at greater risk than larger ones. A comprehensive DoE finds paste and placement offsets to be the top contributor to defects.
    Paul Neathway, Andrew Butterfield, Quyen Chu, Nick Tokotch, Robert Haddick, Jean-Marc Peallat, Chrys Shea and Prashant Chouta

  • Soldering Materials
    BGA Assembly with Low-Ag Alloy Spheres
    It is possible – under certain process and assembly conditions. However, assemblers must be aware of the impending change, best communicated through a part number change.
    Girish Wable and Paul Neathway

  • Selective Soldering
    Selective Soldering for High-Volume Assembly
    In an EMS environment, selective soldering, using a nozzle pattern, eliminated masking, excessive flux and pallet washing. Solder splashes were eliminated, and overall quality improved drastically.
    Frank Grimard




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On the cover: Tombstoning is an omen for process engineers. (Photos courtesy Jabil)

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