Small Firms, Big Ideas
Thanks in part to the RoHS conversion, companies are busier today than a year ago, but few are thinking about what to do once the Pb-free buzz ends. Plus: Excellence in service.
Mike Buetow and Robin Norvell
AXI Test on Fine-Pitch Components Using Pb-Free and SnPb
A powerful tool for process characterization during the transition to Pb-free solder, this study revealed less than 10% difference for Pb-free and SnPb TVs under different test coupons.
Zhen (Jane) Feng, Ph.D., Eduardo Toledo, Dason Cheung, Jeff Newbrough and Murad Kurwa
Running Pb-Free Reflow Profiles without Nitrogen
TGA/DSC data show paste can be used in extended reflow profiles with reduced dT's even at fast printing speeds.
A Comparison of Convection and Condensation Pb-Free Reflow Soldering
Convection runs at faster cycle times, while condensation is superior for heavier PCBs.
Dr. Hans Bell
A Fixture for Characterizing Underfill
How a simple slab of aluminum and a slot to contain a little pane of tempered glass, ringed by adjustable clamps, can aid visibility.
Lucky number 8.
Electronic Systems' Leo Reynolds.
Focus on Business
What makes a good program manager?
On the Forefront
E. Jan Vardaman
'Tidying up' the process.
X-ray goes under the microscope.
BGA repair for mixed assemblies.
American Competitiveness Institute
Avoiding solder spikes.
Countdown to Pb-Free
RoHS and China.
Richard (Tad) Ferris and Hongjun Zhang, Ph.D.
Europlacer's component positioning system.
Nepcon East Product Preview
On the cover: Solder bumps are shown during reflow in air. (Courtesy Cobar Europe BV)