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FEATURES

  • Apex Recap
    Small Firms, Big Ideas
    Thanks in part to the RoHS conversion, companies are busier today than a year ago, but few are thinking about what to do once the Pb-free buzz ends. Plus: Excellence in service.
    Mike Buetow and Robin Norvell

  • AXI Comparison
    AXI Test on Fine-Pitch Components Using Pb-Free and SnPb
    A powerful tool for process characterization during the transition to Pb-free solder, this study revealed less than 10% difference for Pb-free and SnPb TVs under different test coupons.
    Zhen (Jane) Feng, Ph.D., Eduardo Toledo, Dason Cheung, Jeff Newbrough and Murad Kurwa

  • Cover Story
    Running Pb-Free Reflow Profiles without Nitrogen
    TGA/DSC data show paste can be used in extended reflow profiles with reduced dT's even at fast printing speeds.
    Eli Westerlaken

  • Reflow Soldering
    A Comparison of Convection and Condensation Pb-Free Reflow Soldering
    Convection runs at faster cycle times, while condensation is superior for heavier PCBs.
    Dr. Hans Bell

  • Underfill Characterization
    A Fixture for Characterizing Underfill
    How a simple slab of aluminum and a slot to contain a little pane of tempered glass, ringed by adjustable clamps, can aid visibility.
    Tom Clifford

FIRST PERSON

  • Caveat Lector
    Lucky number 8.
    Mike Buetow

  • Letters

  • Talking Heads
    Electronic Systems' Leo Reynolds.
    Mike Buetow

MONEY MATTERS

  • Focus on Business
    What makes a good program manager?
    Susan Mucha

TECH TALK

  • On the Forefront
    Maxed out.
    E. Jan Vardaman

  • Screen Printing
    'Tidying up' the process.
    Clive Ashmore

  • Better Manufacturing
    X-ray goes under the microscope.
    Peter Grundy

  • Soldering Tips
    BGA repair for mixed assemblies.
    American Competitiveness Institute

  • Wave Soldering
    Avoiding solder spikes.
    Gerjan Diepstraten

  • Countdown to Pb-Free
    RoHS and China.
    Richard (Tad) Ferris and Hongjun Zhang, Ph.D.

  • Equipment Advances
    Europlacer's component positioning system.

  • Technical Abstracts

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On the cover: Solder bumps are shown during reflow in air. (Courtesy Cobar Europe BV)

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