Cleaning Up after Pb-Free
Lacking field data for no-clean Pb-free solders and confidence in accelerated aging tests? An expected increase in contaminants means effective cleaning is the only way to guarantee an assembly won't fail due to residues.
Concurrent Manufacturing in an EMS Environment
The changes and precautions to take down the line during implementation of Pb-free manufacturing. This review covers printing, placement, soldering, inspection, materials management, compatibility and marking.
Amey Teredesai and Tony Batalha
Pb-Free Solder Assembly for Mixed-Technology Boards
While assemblers push for a single alloy throughout all soldering processes to avoid cross-contamination, tests show no joint degradation related to the mixing of SN100C and SAC alloys.
Increasing Process Reliability in Fine-Pitch Wire Bonding
A two-year study involving millions of bonds on LQFPs and BGAs identifies close ties between the performance of the wire bonder capillary and subsequent failures.
A platform for all electronics.
RVSI's Kevin Maddy.
Focus on Business
Data mining in EMS.
Qualification methods for CSPs.
On the Forefront
R&D's new model.
E. Jan Vardaman
Using DPMO to rate equipment performance.
HALT and HASS testing.
The new GEIA Pb-free guide.
American Competitiveness Institute
Guarding your pot.
Test and Inspection
Pin-in-hole reflow inspection.
Dr. David Bernard and Bob Willis
Countdown to Pb-Free
Recommendations for thermally challenging products.
Joe Smetana and Thilo Sack
Eliminating ESD in the air.
David E. Swenson
Resolving sulfate contamination.
ECT's new board tester.
Nepcon China and SMT/Hybrid/Packaging Product Preview
On the cover: Due to a lack of Pb-free aging data, cleaning may make a comeback. (Cover photo courtesy Humiseal/Chase Specialty Coatings.)