SPI 4000 high-speed solder paste inspection system features rapid programming; dual projection illumination; excellent accuracy. Offers high-speed 3-D or 2D SPI. Full SPC software suite; operates on Windows 7, 64-bit OS.

Intek Plus, www.intekplus.com

Christopher Associates, www.christopherweb.com

PCB Vertical Carrier accommodates almost any size printed circuit board. ESD-safe cart includes two bottom rows of adjustable guides and one back row, eliminating spilled boards. Footprint is 16" x 10" and 5". Customized slotting configurations, carriers and board support rails available. Comes in single- and double-sided models. Carrier supports can be rearranged without tools. Carriers can hang from the cart, sit on a workstation, lie on flat surfaces, or be set on existing flat wire cart shelves. Costs approximately 30% less than 20 slot tray carts and will handle larger quantities of boards.

Bliss Industries, www.blissindustries.com

Fusion3D 1100 uses laser direct structuring and molded interconnect devices to combine mechanical structures and electronic circuits into a single 3-D part. Uses LDS-grade resin laser activated by a scanner-based laser system. Circuit pattern is written directly onto the molded piece; conductive paths are plated using electroless plating technology, adhering only to where the plastic has been activated by the laser beam. For small-volume production.

LPKF Laser & Electronics, www.lpkfusa.com 

UA-2605 reworkable edgebond adhesive improves thermal cycle performance of CBGAs and plastic BGAs. In a trial, it reportedly tripled the 0° to +100°C performance of a CBGA to nearly 2,500 cycles.  Only four beads of adhesive required, one at each corner. No need to preheat board; no need to wait for underfill flow; no need for multiple dispensing passes.

Zymet, www.zymet.com