SLM120 high-speed LED mounter reportedly increases speed, efficiency and throughput by means of an adaptive head design; can simultaneously pick up multiple LEDs from a single feeder, regardless of LED size or tape pocket pitch. Can place LED packages from one feeder in excess of 28,000 cph on printed circuit boards up to 1200mm in length.  Has a dual-gantry design and single-side operation.

Samsung Techwin Co. Ltd., www.samsung-smt.com    

Mydata Midas C24 MicroMelf nozzles are for OD 1mm MELF components. Feature a tool tip radius of 0.5mm and a tool tip diameter of 2mm. Replacement nozzle tips come in packs of three. Are compatible with the following machine types: TP9-1, TP9-2, TP9-3, TP9-4, TP11, TP12, TP18, MY9, MY12, MY15, MY19 and MY100 (SX/DX). Replacement tooling nozzles include Standard Midas nozzles (A12, A13, B12, C14, A24S, etc.), Custom Midas nozzles (B34 Melf, Grippers, LED Nozzles, etc.), Hydra nozzles (H01, H02, H03, etc.) and other spare consumables (filters, grease, feeder parts, spare tips, etc.).

Count On Tools, www.cotinc.com

Generation 88 through-hole placement machine offers improved speed, throughput and functionality with a new control architecture and operating system. Includes Radial 88, VCD/Sequencer 88, and the Single-head Jumper Wire 88. Is suited for LED and other solid state lighting placement. Has low PPM levels. Available in standalone and pass-through configurations.

Universal Instruments, www.uic.com

Ablestik C100 series conductive die attach films come in 30 and 15 µm thicknesses. Can process thinner die and facilitate greater bondline control. Die sizes range from 1 x 1mm up to 6 x 6mm for a variety of package types, including QFNs and QFPs. Reportedly show excellent wetting ability and low bonding temperature; robust adhesion against moisture and MSL Level 2 performance on all leadframe surface finishes.

Henkel, www.henkel.com/electronics