Zymet Rolls Out UA-2605 Edgebond Adhesive
Published: 08 April 2011
UA-2605 reworkable edgebond adhesive improves thermal cycle performance of CBGAs and plastic BGAs. In a trial, it reportedly tripled the 0° to +100°C performance of a CBGA to nearly 2,500 cycles. Only four beads of adhesive required, one at each corner. No need to preheat board; no need to wait for underfill flow; no need for multiple dispensing passes.
Zymet, www.zymet.com
