Fusion3D 1100 uses laser direct structuring and molded interconnect devices to combine mechanical structures and electronic circuits into a single 3-D part. Uses LDS-grade resin laser activated by a scanner-based laser system. Circuit pattern is written directly onto the molded piece; conductive paths are plated using electroless plating technology, adhering only to where the plastic has been activated by the laser beam. For small-volume production.

LPKF Laser & Electronics, www.lpkfusa.com 

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