MAX series dispensing systems are configured with PCD volumetric dispense technology and a Micro-Dot pump. Are ideal for silver-filled conductive and nonconductive epoxies, solder pastes, adhesives, encapsulants and other fluids used in electronics assembly. Compatible with all GPD’s dispensing pumps, including the Micro-Dot for dispensing below 0.010". Are designed with a 100% molded, unibody frame. Have Contour Mapping software; provide ±0.001" accuracy over the entire work area. Handle up to two different dispense pumps simultaneously. Can be configured with heat for applications such as underfill, encapsulation, or others that may benefit from a heated product.

GPD Global, www.gpd-global.com

Smart GUI software for Siplace placement machines features a new graphical user interface. Displays essential data about the machine's status, current jobs and their progress. If the software detects problems on the line, it converts instantly into an analysis and instruction tool. Categorizes the malfunction and indicates the exact location (machine and track). Initiates self-healing procedures or starts a video assistant to display the steps needed to fix problems. Graphics provide a troubleshooting process step by step. Line personnel reportedly can fix more than 90% of incidents without a special technician.

ASM Assembly Systems, www.siplace.com

Multicore MF210 no-clean, sustained activity flux is compatible with Pb-free and SnPb processes.  Halide-free, resin-free material is effective with a range of solder resists, as well as rosin and OSPs. Has a wide process window and a preheat temperature range of 80° to 130°C; has a one- to three-sec. contact time on the wave. Can be used in single- and dual-wave processes. Reduces solder microballing.

Henkel Electronic Materials, www.henkel.com/electronics

Cobra pick-and-place machine is a three-step SMEMA inline system, with an octagonal placement head, up to two dispensing valves, customizable machine finishing, up to 240 feeder slots, a mineral cast chassis, and ePlace software. Motion system is constructed as a real-time system that reduces the number of cables in the machine. Mounts device packages from 01005s, QFPs, complex BGAs, QFNs, CSPs, bare dies, and connectors to odd shapes up to 10 x 150 mm.

Essemtec, www.essemtec.com