Agilent TS-8900 automotive functional test system is a standardized PXI-based solution for testing medium- to high-pin-count electronic control units. Provides up to 20% better throughput compared with earlier Agilent automotive functional tester. Has simultaneous measurement channel capabilities. Includes 32-channel M9216A high-voltage data acquisition module. Capable of acquiring voltage levels ranging from 1 mV to 100 V at 250kSa/s per channel simultaneously. Provides direct connectivity to ECUs without the need for external front-end signal conditioning circuitry. Comes with a suite of more than 200 built-in applications-tuned test libraries.

Agilent Technologies, www.agilent.com

Model 2651A SourceMeter instrument reportedly provides the widest current range available for testing high brightness LEDs, power semiconductors, DC-DC converters, batteries, and other high power materials, components, modules and subassemblies. Offers a four-quadrant voltage and current source/load coupled with precision voltage and current meters. Combines functionality of multiple instruments in a single full-rack enclosure: semiconductor characterization instrument, precision power supply, current source, DMM, arbitrary waveform generator, V or I pulse generator, electronic load and trigger controller. Is expandable into a multi-channel synchronized system via TSP-Link technology. Can source or sink up to 2,000W of pulsed power (±40V, ±50A) or 200W of DC power (±10V@±20A, ±20V@±10A, ±40V@±5A). Measures signals as low as 1pA and 100 mV at speeds up to one microsec. per reading. Provides a choice of digitizing or integrating measurement modes for characterization of transient and steady-state behavior. TSP Express LXI-based I-V test software is embedded.

Keithley Instruments, www.keithley.com

NicAlloy-XT stencil technology combines NicAlloy and electroform stencils. Bridges the gap between traditional laser cut stencils and electroform stencils. Meets aspect ratios down to 0.46. Incorporates NiPlate process for smooth aperture walls. Offers superior paste release and improved underscreen cleaning. Manufacturing processes produce uniform stencil thickness; high-quality print deposit.

Photo Stencil, www.photostencil.com

VT-RNSII inline post-reflow inspection uses faster shutter speeds and improved image processing to perform inspections 20% faster than the original VT-RNS series. Permits faster throughput and more detailed inspections of densely populated boards within the same cycle time. Uses color highlight system, which provides 3-D information from a 2-D image; uses RGB LEDs in a dome configuration. 3-CCD camera obtains 3x the information of a conventional 1-CCD camera. Offers high resolution of up to 10 μm; supports inspection of components as small as 01005 and 0.0012" pitch. Optical character verification is standard. Includes EzTS program generation software. VT-RNSII-ptH benchtop model is available.

Omron Industrial Automation, www.omron.com