News
SAN JOSE, CA – Ahead of its acquisition of Broadcom, Avago is selling its optical module unit to Foxconn for an undisclosed sum.
LYON, FRANCE – The volume of devices packaged using flip chip technology will double from 16 million wafers per year in 2014 to 32 million wafers per year in 2020, reaching $25 billion, says Yole Développement.
MONTERREY, MEXICO – Nortech Systems has launched printed circuit board assembly manufacturing at its facility here.
BANNOCKBURN, IL – North American printed circuit board orders grew 24.1% year-over-year in August, increasing year-to-date order growth to 6.2%. Orders were up 11.3% sequentially, says IPC.
OYSTER BAY, NY – The total head mounted display market is expected to ship around 65 million units in 2020, with a CAGR of 88%, says ABI Research.
MOORPARK, CA – TestEquity, distributor of test and measurement equipment, has integrated an electronics lab and manufacturing tools and supplies.
Press Releases
- The Science of the Perfect Solder Joint
- Q Source Adds Electro-Tech Systems, Inc. to Supplier Lineup, Enhancing ESD and Environmental-Control Offerings
- Dynalec Selects Austin American Technology’s MicroJet EC® to Strengthen Electronics Cleaning Processes
- NOTE strengthens its leadership – Bahare Mackinovski appointed Chief Sales and Marketing Officer