News
AUSTIN, TX – Applications for 3-D TSV, including image sensors, flash, DRAM, processors, FPGAs and power amplifiers, will be adopted, but the timing for mass production depends on how the cost compares with that of existing technologies, says TechSearch International in a new report.
Image sensors for camera modules are already in volume production, but for other applications, the adoption time is longer than originally predicted, as is common with the introduction of many new technologies, the company says. Design, thermal and test issues remain a barrier to TSV adoption in some applications, though progress is being made.
The report, “Through Silicon Via Technology: The Ultimate Market for 3D Interconnect,” provides a timeline for the adoption of TSV in these applications. The report forecasts market size in units and number of wafers for each application area.
Driven by the need for improved performance and reduced timing delays, methods have been developed to use short vertical interconnects instead of the long interconnects used in 2-D structures. The industry is moving past the feasibility (R&D) phase for TSV technology and into commercialization, where economic realities will determine which technologies are adopted, says the firm. Low-cost fine via hole formation and reliable via filling technologies have been demonstrated; process equipment and materials are available.
Image sensors for camera modules are already in volume production, but for other applications, the adoption time is longer than originally predicted, as is common with the introduction of many new technologies, the company says. Design, thermal and test issues remain a barrier to TSV adoption in some applications, though progress is being made.
The report, “Through Silicon Via Technology: The Ultimate Market for 3D Interconnect,” provides a timeline for the adoption of TSV in these applications. The report forecasts market size in units and number of wafers for each application area.
Driven by the need for improved performance and reduced timing delays, methods have been developed to use short vertical interconnects instead of the long interconnects used in 2-D structures. The industry is moving past the feasibility (R&D) phase for TSV technology and into commercialization, where economic realities will determine which technologies are adopted, says the firm. Low-cost fine via hole formation and reliable via filling technologies have been demonstrated; process equipment and materials are available.
TAIPEI – The world’s No. 3 PC maker, Acer Inc., reported its fourth-quarter net profit was $71.88 million, up 77% year-over-year, with its purchase of Gateway. Profit fell 21.8% sequentially.
BRIDGEWATER, MA – Chase Corp. has named Adam Chase president and chief operating officer.
Chase, grandson of the company’s founder, joined the firm in 1998 and has held the positions of controller, general manager and vice president, among others.
Chase manufactures tapes, laminates, sealants and coatings for high reliability applications, and provides contract assembly services.
Chase, grandson of the company’s founder, joined the firm in 1998 and has held the positions of controller, general manager and vice president, among others.
Chase manufactures tapes, laminates, sealants and coatings for high reliability applications, and provides contract assembly services.
JACKSON, MI – EMS provider Sparton Corp. reported 2008 second-quarter net sales of $55 million, up 3.6% year-over-year. The net loss for the quarter ended Dec. 31 rose to $1.9 million, from $1.4 million in 2006.
SOUTHAMPTON, UK – ACW Technology Ltd. and Silicon Forest Electronics have formed a partnership under which the two companies will share certain facilities around the world with each other’s customers.
SAN JOSE – Flextronics today announced plans to acquire the FRIWO Mobile Power business unit of CEAG AG. No other financial terms were disclosed.
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